Multilayer electronic component

ABSTRACT

A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with respective dielectric layers interposed therebetween; a first external electrode including a first connection portion, and first and second band portions extending from the first connection portion; a second external electrode including a second connection portion, and second and fourth band portions extending from the second connection portion; an insulating layer disposed to extend to a portion on the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer. An average thickness of the first or second plating layer is smaller than an average thickness of the insulating layer.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims benefit of priority to Korean Patent Application No. 10-2021-0194177 filed on Dec. 31, 2021 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a multilayer electronic component.

BACKGROUND

A multilayer ceramic capacitor (MLCC), a multilayer electronic component, may be a chip-type condenser mounted on the printed circuit boards of any of various electronic products, such as an imaging device, including a liquid crystal display (LCD) or a plasma display panel (PDP), a computer, a smartphone, or a mobile phone, serving to charge or discharge electricity therein or therefrom.

The multilayer ceramic capacitor has a small size, implements high capacitance, and is easily mounted on a circuit board, and may thus be used as a component of various electronic devices. There has been increasing demand for the multilayer ceramic capacitor to have a smaller size and higher capacitance as each of various electronic devices such as a computer and a mobile device have a smaller size and higher output.

In recent years, as industry interest in electronic products has increased, multilayer ceramic capacitors have been required to have high reliability characteristics to be used in automobiles and infotainment systems.

To achieve miniaturization and high capacitance of a multilayer ceramic capacitor, the number of laminated layers needs to be decreased by forming internal electrodes and dielectric layers to be thin, and a volume of a portion which does not affect formation of capacitance needs to be significantly reduced to increase an effective volume fraction required to implement capacitance.

In addition, amounting space needs to be significantly reduced to mount as many components as possible in a limited area of a board.

In addition, as a margin thickness is decreased with miniaturization and high capacitance of a multilayer ceramic capacitor, permeation of external moisture or permeation of a plating solution may be facilitated to deteriorate reliability.

Accordingly, there is a need for a method of protecting a multilayer ceramic capacitor from permeation of external moisture or permeation of a plating solution.

SUMMARY

An aspect of the present disclosure is to provide a multilayer electronic component having improved capacitance per unit volume.

Another aspect of the present disclosure is to provide a multilayer electronic component having improved reliability.

Another aspect of the present disclosure is to provide a multilayer electronic component which may significantly reduce a mounting space.

According to another aspect of the present disclosure, a multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion onto a portion of the first surface, and a third band portion extending from the first connection portion onto a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, a second band portion extending from the second connection portion onto a portion of the first surface, and a fourth band portion extending from the second connection portion onto a portion of the second surface; an insulating layer disposed on the second surface and disposed to extend to a portion on the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer. A thickness of each of the first and second plating layers is smaller than a thickness of the insulating layer.

According to another aspect of the present disclosure, a multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second externa electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed to cover an entirety of the second surface and disposed to extend to portions of the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer. In the multilayer electronic component, t1/t2 is 0.67 or less, where t1 is an average thickness of the first or second plating layer, and t2 is an average thickness of the insulating layer.

According to another aspect of the present disclosure, a multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer. The first and second external electrodes are disposed on a level the same as or lower than an extension line of the second surface. In the multilayer electronic component, t1/t2 is 0.67 or less, where t1 is an average thickness of the first or second plating layer, and t2 is an average thickness of the insulating layer.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description, taken in conjunction with the accompanying drawings.

FIG. 1 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment in the present disclosure.

FIG. 2 is a schematic perspective view of a body of the multilayer electronic component of FIG. 1 .

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 1 .

FIG. 4 is a schematic exploded perspective view of the body of FIG. 2 .

FIG. 5 is a schematic perspective view of a substrate on which the multilayer electronic component of FIG. 1 is mounted.

FIG. 6 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment in the present disclosure.

FIG. 7 is a cross-sectional view taken along line II-II′ of FIG. 6 .

FIG. 8 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment in the present disclosure.

FIG. 9 is a cross-sectional view taken along line III-III′ of FIG. 8 .

FIG. 10 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment in the present disclosure.

FIG. 11 is a cross-sectional view taken along line IV-IV′ of FIG. 10 .

FIG. 12 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment in the present disclosure.

FIG. 13 is a cross-sectional view taken along line V-V′ of FIG. 12 .

FIG. 14 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment in the present disclosure.

FIG. 15 is a cross-sectional view taken along line VI-VI′ of FIG. 14 .

FIG. 16 is a view illustrating a modified example of FIG. 14 .

FIG. 17 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment in the present disclosure.

FIG. 18 is a cross-sectional view taken along line VII-VII′ of FIG. 17 .

FIG. 19 is a view illustrating a modified example of FIG. 17 .

FIG. 20 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment in the present disclosure.

FIG. 21 is a cross-sectional view taken along line VIII-VIII′ of FIG. 20 .

FIG. 22 is a view illustrating a modified example of FIG. 20 .

FIG. 23 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment in the present disclosure.

FIG. 24 is a cross-sectional view taken along line IX-IX′ of FIG. 23 .

FIG. 25 is a view illustrating a modified example of FIG. 23 .

FIG. 26 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment in the present disclosure.

FIG. 27 is a cross-sectional view taken along line X-X′ of FIG. 26 .

FIG. 28 is a view illustrating a modified example of FIG. 25 .

FIG. 29 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment in the present disclosure.

FIG. 30 is a cross-sectional view taken along line XI-XI′ of FIG. 29 .

FIG. 31 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment in the present disclosure.

FIG. 32 is a cross-sectional view taken along line XII-XII′ of FIG. 31 .

FIG. 33 is an enlarged view of region K1 of FIG. 32 .

FIG. 34 is an enlarged view of region P in FIG. 15 according to one exemplary embodiment of the present disclosure.

FIG. 35 is an enlarged view of region P in FIG. 15 according to another exemplary embodiment of the present disclosure.

FIG. 36 illustrates another modified example from FIG. 14 .

FIG. 37 illustrates still another modified example from FIG. 14 .

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described as follows with reference to the attached drawings.

The present disclosure may, however, be exemplified in many different forms and should not be construed as being limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Accordingly, shapes and sizes of elements in the drawings may be exaggerated for clear description, and elements indicated by the same reference numeral are the same elements in the drawings.

In the drawings, certain elements may be omitted to clearly illustrate the present disclosure, and to clearly express a plurality of layers and areas, thicknesses may be magnified. The same elements having the same function within the scope of the same concept will be described using the same reference numeral. Further, throughout the specification, it will be understood that when a portion “includes” an element, it can further include another element, not excluding another element, unless otherwise indicated.

In the drawings, a first direction may refer to a thickness T direction, a second direction may refer to a length L direction, and a third direction may refer to a width W direction.

FIG. 1 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment in the present disclosure.

FIG. 2 is a schematic perspective view of a body of the multilayer electronic component of FIG. 1 .

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 1 .

FIG. 4 is a schematic exploded perspective view of the body of FIG. 2 .

FIG. 5 is a schematic perspective view of a substrate on which the multilayer electronic component of FIG. 1 is mounted.

Hereinafter, a multilayer electronic component 1000 according to an exemplary embodiment in the present disclosure will be described with reference to FIGS. 1 to 5 .

The multilayer electronic component 1000 according to an exemplary embodiment in the present disclosure may include a body 110 including dielectric layers 111 and first and second internal electrodes 121 and 122 alternately disposed with respective dielectric layers 111 interposed therebetween and having first and second surfaces 1 and 2 opposing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and opposing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces 1, 2, 3, and 4 and opposing each other in a third direction; a first external electrode 131 including a first connection portion 131 a disposed on the third surface 3, a first band portion 131 b extending from the first connection portion 131 a onto a portion of the first surface 1, and a third band portion 131 c extending from the first connection portion 131 a onto a portion of the second surface 2; a second external electrode 132 including a second connection portion 132 a disposed on the fourth surface 4, a second band portion 132 b extending from the second connection portion 132 a onto a portion of the first surface 1, and a fourth band portion 132 c extending from the second connection portion 132 a onto a portion of the second surface 2; an insulating layer 151 disposed on the second surface 2 and disposed to extend to a portion on the first and second connection portions 131 a and 132 a; a first plating layer 141 disposed on the first band portion 131 b and disposed to extend to be in contact with the insulating layer 151; and a second plating layer 142 disposed on the second band portion 132 b and disposed to extend to be in contact with the insulating layer 151. A thickness “t1” of each of the first and second plating layers 141 and 142 is smaller than a thickness “t2” of the insulating layer 151.

In the body 110, the dielectric layers 111 and the internal electrodes 121 and 122 may be alternately laminated.

The body 110 is not limited to a particular shape, and may have a hexahedral shape or a shape similar to the hexahedral shape, as illustrated in the drawings. The body 110 may not have the shape of a hexahedron having perfectly straight lines because ceramic powder particles included in the body 110 are contracted in a process in which the body is sintered. However, the body 110 may have a substantially hexahedral shape.

The body 110 may have the first and second surfaces 1 and 2 opposing each other in the first direction, the third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and opposing each other in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2, connected to the third and fourth surfaces 3 and 4, and opposing each other in the third direction.

In an exemplary embodiment, the body 110 may have a 1-3-th corner connecting the first surface 1 and the third surface 3 to each other, a 1-4-th corner connecting the first surface 1 and the fourth surface 4 to each other, a 2-3-th corner connecting the second surface 2 and the third surface 3 to each other, and a 2-4-th corner connecting the second surface 2 and the fourth surface 4 to each other. The 1-3-th corner and the 2-3-th corner may have a shape contracted to a center of the body 110 in the first direction toward the third surface 3, and the 1-4-th corner and the 2-4-th corner may have a shape contracted to a center of the body 110 in the first direction toward the fourth surface 4.

As a margin region, in which the internal electrodes 121 and 122 are not disposed, overlaps the dielectric layer 111, a step may be formed by thicknesses of the internal electrodes 121 and 122, so that a corner connecting the first surface 1 to the third to fifth surfaces 3, 4, and 5 and/or a corner connecting the second surface 2 to the third to fifth surfaces 3, 4, and 5 may have a shape contracted to a center of the body 110 in the first direction when viewed with respect to the first surface 1 or the second surface 2. Alternatively, by a contraction behavior during a sintering process of the body 110, a corner connecting the first surface 1 to the third to sixth surfaces 3, 4, 5, and 6 and/or a corner connecting the second surface 2 to the third to sixth surfaces 3, 4, 5, and 6 may have a shape contracted to a center of the body 110 in the first direction when viewed with respect to the first surface 1 or the second surface 2. Alternatively, as a corner connecting respective surfaces of the body 110 to each other is rounded by performing an additional process to prevent chipping defects, or the like, a corner connecting the first surface 1 to the third to sixth surfaces 3, 4, 5, and 6 and/or a corner connecting the second surface 2 to the third to sixth surfaces 3, 4, 5, and 6 may have a rounded shape.

The corner may include a 1-3-th corner connecting the first surface 1 and the third surface 3 to each other, a 1-4-th corner connecting the first surface 1 and the fourth surface 4 to each other, a 2-3-th corner connecting the second surface 2 and the third surface 4 to each other, and a 2-4-th corner connecting the second surface 2 and the fourth surface 4 to each other. In addition, the corner may include a 1-5-th corners connecting the first surface 1 and the fifth surface 5 to each other, a 1-6-th corner connecting the first surface 1 and the sixth surface 6 to each other, a 2-5-th corner connecting the second surface 2 and the fifth surface 5 to each other, and a 2-6-th corner connecting the second surface 2 and the sixth surface 6 to each other. The first to sixth surfaces 1, 2, 3, 4, 5, and 6 of the body 110 may be overall planar surfaces, and non-planar regions may be corners. Hereinafter, an extension line of each surface may refer to a line extending based on a planar portion of each surface.

In the external electrodes 131 and 132, a region disposed on a corner of the body 110 may be referred to as a corner portion, a region disposed on the third and fourth surfaces 3 and 4 of the body 110 may be referred to as a connection portion, and a region disposed on the first and second surfaces 1 and 2 of the body 110 may be referred to as a band portion.

When margin portions 114 and 115 are formed by laminating the internal electrodes 121 and 122, cutting the laminated internal electrodes 121 and 122 to be exposed to the fifth and sixth surfaces 5 and 6 of the body 110, and laminating a single dielectric layer or two or more dielectric layers on opposite side surfaces of a capacitance formation portion Ac to suppress a step formed by the internal electrodes 121 and 122, a portion connecting the first surface 1 to the fifth and sixth surfaces 5 and 6 and a portion connecting the second surface 2 to the fifth and sixth surfaces 5 and 6 may not have a contracted form.

A plurality of dielectric layers 111 forming the body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other, such that boundaries therebetween may not be readily apparent without a scanning electron microscope (SEM).

According to an exemplary embodiment in the present disclosure, a raw material of the dielectric layer 111 is not particularly limited as long as sufficient capacitance may be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like, may be used as the raw material of the dielectric layer 111. The barium titanate-based material may include BaTiO₃-based ceramic powder particles. Examples of the BaTiO₃-based ceramic powder particles may include BaTiO₃ and (Ba_(1-x)Ca_(x))TiO₃ (0<x<1), Ba(Ti_(1-y)Ca_(y)) O₃ (0<y<1), (Ba_(1-x)Ca_(x)) (Ti_(1-y)Zr_(y)) O₃ (0<x<1 and 0<y<1), Ba(Ti_(1-y)Zr_(y)) O₃ (0<y<1), or the like, in which calcium (Ca), zirconium (Zr), or the like, is partially solid-dissolved in BaTiO₃.

In addition, a raw material of the dielectric layer 111 may include various ceramic additives, organic solvents, binders, dispersants, and the like, added to powder particles such as barium titanate (BaTiO₃) powder particles, or the like, according to an object of the present disclosure.

An average thickness “td” of the dielectric layer 111 does not need to be limited.

However, in general, when the dielectric layer is formed to have a small thickness less than 0.6 μm, for example, when a thickness of the dielectric layer is 0.35 μm or less, reliability may be deteriorated.

According to an exemplary embodiment, by disposing a cover layer on a connection portion of an external electrode and disposing a plating layer on a band portion of the external electrode, permeation of external moisture and permeation of a plating solution, and the like, may be prevented to improve reliability. Therefore, improved reliability may be ensured even when the average thickness of the dielectric layer 111 is 0.35 μm or less.

Accordingly, when the average thickness of the dielectric layer 111 is 0.35 μm or less, a reliability improvement effect according to the present disclosure may become more remarkable.

The average thickness “td” of the dielectric layer 111 may refer to an average thickness of the dielectric layer 111 disposed between first and second internal electrodes 121 and 122.

The average thickness of the dielectric layer 111 may be measured from an image obtained by scanning a cross-section of the body 110 in the length and thickness directions (L-T) with a scanning electron microscope (SEM) of 10,000 magnifications. More specifically, an average value may be measured by measuring thicknesses of one dielectric layer at 30 points positioned at equal intervals in the length direction in the obtained image. The 30 points positioned at equal intervals may be designated in the capacitance formation portion Ac. In addition, when an average thickness of ten dielectric layers is measured, the average thickness of the dielectric layers may further be generalized.

The body 110 may include the capacitance formation portion Ac, disposed in the body 110 and including the plurality of internal electrodes 121 and 122 disposed to face each other with respective dielectric layers 111 interposed therebetween, and the cover portions 112 and 113, respectively disposed above and below the capacitance formation portion Ac in the first direction.

In addition, the capacitance formation portion Ac, which contributes to formation of capacitance of a capacitor, may be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with respective dielectric layers 111 interposed therebetween.

The cover portions 112 and 113 may include an upper cover portion 112, disposed above the capacitance formation portion Ac in the first direction, and a lower cover portion 113 disposed below the capacitance formation portion Ac in the first direction.

The upper cover portion 112 and the lower cover portion 113 may be formed by laminating a single dielectric layer or two or more dielectric layers on upper and lower surfaces of the capacitance formation portion Ac, respectively, in the thickness direction, and may basically serve to prevent damage to the internal electrodes caused by physical or chemical stress.

The upper cover portion 112 and the lower cover portion 113 may not include the internal electrodes, and may include the same material as the dielectric layer 111.

For example, the upper cover portion 112 and the lower cover portion 113 may include a ceramic material such as a barium titanate (BaTiO₃)-based ceramic material.

An average thickness “tc” of the cover portion 112 or 113 does not need to be limited. However, the average thickness “tc” of the cover portion 112 or 113 may be 15 μm or less to more easily achieve the miniaturization and the high capacitance of the multilayer electronic component. In addition, according to an exemplary embodiment, by disposing a cover layer on a connection portion of an external electrode and disposing a plating layer on a band portion of the external electrode, permeation of external moisture and permeation of a plating solution may be prevented to improve reliability. Therefore, improved reliability may be ensured even when the average thickness “tc” of the cover portions 112 or 113 is 15 μm or less.

The average thickness “tc” of the cover portion 112 or 113 may refer to a size of the cover portion 112 or 113 in the first direction, and may be an average value of sizes, in the first direction, of the upper cover portion 112 measured at five points disposed at equal intervals on the upper or lower surface of the capacitance formation portion Ac.

In addition, margin portions 114 and 115 may be disposed on side surfaces of the capacitance formation portion Ac.

The margin portions 114 and 115 may include a margin portion 114, disposed on the fifth surface 5 of the body 110, and a margin portion 115 disposed on the sixth surface 6 of the body 110. For example, the margin portions 114 and 115 may be disposed on opposite end surfaces of the ceramic body 110 in the width direction, respectively.

The margin portions 114 and 115 may refer to regions between both distal ends of the first and second internal electrodes 121 and 122 and boundary surfaces of the body 110 in a cross-section of the body 110 taken in the width-thickness (W-T) directions, as illustrated in FIG. 3 .

The margin portions 114 and 115 may basically serve to prevent damage to the internal electrodes caused by physical or chemical stress.

The margin portions 114 and 115 may be formed by applying a conductive paste to ceramic green sheets, except for places in which the margin portions are to be formed to form the internal electrodes.

In addition, to suppress a step formed by the internal electrodes 121 and 122, the margin portions 114 and 115 may be formed by laminating ceramic green sheets, cutting the laminated ceramic green sheets to expose the internal electrodes to the fifth and sixth surfaces 5 and 6 of the body 110, and then laminating a single dielectric layer or two or more dielectric layers on opposite side surfaces of the capacitance formation portion Ac in the third direction (the width direction).

An average width of the margins 114 and 115 do not need to be limited. However, the average width of the margin portions 114 or 115 may be 15 μm or less to more easily achieve miniaturization and high capacitance of the multilayer electronic component. In addition, according to an exemplary embodiment, by disposing a cover layer on a connection portion of an external electrode and disposing a plating layer on a band portion of the external electrode, permeation of external moisture and permeation of a plating solution may be prevented to improve reliability. Therefore, improved reliability may be ensured even when the average width of the margin portion 114 or 115 is 0.35 μm or less.

The average width of the cover portion 112 or 113 may refer to an average value of sizes, in the third direction, of the margin portion 112 or 113 measured at five points disposed at equal intervals on a side surface of the capacitance formation portion Ac.

The internal electrodes 121 and 122 may be laminated alternately with the dielectric layer 111.

The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 may be alternately disposed to face each other with respective dielectric layers 111, constituting the body 110, interposed therebetween, and may be exposed to the third and fourth surfaces 3 and 4 of the body 110, respectively.

Referring to FIG. 3 , the first internal electrode 121 may be spaced apart from the fourth surface 4 and may be exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and may be exposed through the fourth surface 4. A first external electrode 131 may be disposed on the third surface 3 of the body to be connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the body to be connected to the second internal electrode 122.

For example, the first internal electrode 121 may not be connected to the second external electrode 132 and may be connected to the first external electrode 131, and the second internal electrode 122 may not be connected to the first external electrode 131 and may be connected to the second external electrode 132. Accordingly, the first internal electrode 121 may be formed to be spaced apart from the fourth surface 4 by a predetermined distance, and the second internal electrode 122 may be formed to be spaced apart from the third surface 3 by a predetermined distance.

In this case, the first and second internal electrodes 121 and 122 may be electrically separated from each other by the dielectric layer 111 disposed therebetween.

The body 110 may be formed by alternately laminating a ceramic green sheet, on which the first internal electrode 121 is printed, and a ceramic green sheet, on which the second internal electrode 122 is printed, and sintering the laminated ceramic green sheets.

A material of each of the internal electrodes 121 and 122 is not limited, and may be a material having excellent electrical conductivity. For example, the internal electrodes 121 and 122 may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), or alloys thereof.

In addition, the internal electrodes 121 and 122 may be formed by printing a conductive paste for an internal electrode including at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), or alloys thereof on ceramic green sheets. A method of printing the conductive paste for an internal electrode may be a screen printing method, a gravure printing method, or the like, but exemplary embodiments are not limited thereto.

An average thickness “te” of the internal electrodes 121 and 122 does not need to be limited.

However, in general, when the internal electrode is formed to have a small thickness less than 0.6 μm, for example, when a thickness of the internal electrode is 0.35 μm or less, reliability may be deteriorated.

According to an exemplary embodiment, by disposing a cover layer on a connection portion of an external electrode and disposing a plating layer on a band portion of the external electrode, permeation of external moisture and permeation of a plating solution may be prevented to improve reliability. Therefore, improved reliability may be ensured even when the average thickness of the internal electrodes 121 and 122 is 0.35 μm or less.

Accordingly, when the average thickness of the internal electrodes 121 and 122 is 0.35 μm or less, an effect of the multilayer electronic component according to the present disclosure may become more remarkable, and miniaturization and high capacitance of the multilayer electronic component may be more easily achieved.

The average thickness “te” of the internal electrodes 121 and 122 may refer to an average thickness of the first and second internal electrodes 121 and 122.

The average thickness of the internal electrodes 121 and 122 may be measured from an image obtained by scanning a cross-section of the body 110 in the length and thickness directions (L-T) with a scanning electron microscope (SEM) of 10,000 magnifications. More specifically, an average value may be measured by measuring thicknesses of one internal electrode at 30 points positioned at equal intervals in the length direction in the obtained image. The 30 points positioned at equal intervals may be designated in the capacitance formation portion Ac. In addition, when an average thickness of ten internal electrodes is measured, the average thickness of the internal electrode layer may be further generalized.

The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110. The external electrodes 131 and 132 may include first and second external electrodes 131 and 132, respectively disposed on the third and fourth surfaces 3 and 4 of the body 110 to be connected to the first and second internal electrodes 121 and 122.

The external electrodes 131 and 132 may include a first external electrode 131, including a first connection portion 131 a disposed on the third surface and the first band portion 131 b extending from the first connection portion 131 a onto a portion of the first surface, and a second external electrode 132 including a second connection portion 132 a disposed on the fourth surface and a second band portion 132 b extending from the second connection portion 132 a onto a portion of the first surface. The first connection portion 131 a may be connected to the first internal electrode 121 on the third surface, and the second connection portion 132 a may be connected to the second internal electrode 122 on the fourth surface.

In addition, the first external electrode 131 may include a third band portion 131 c extending from the first connection portion 131 a onto a portion of the second surface, and the second external electrode 132 may include a fourth band portion 132 c extending from the second connection portion 132 a onto a portion of the second surface. Furthermore, the first external electrode 131 may include a side band portion extending from the first connection portion 131 a onto a portion of the fifth and sixth surfaces, and the second external electrode 132 may include a side band portion extending from the second connection portion 132 a onto a portion of the fifth and sixth surfaces.

However, the third band portion, the fourth band portion, the side band portion, and the second side band portion may not be essential components of the present disclosure. The first and second external electrodes 131 and 132 may not be disposed on the second surface, and may also not be disposed on the fifth and sixth surfaces. In addition, the first and second connection portions 131 a and 132 a may be disposed to be spaced apart from the fifth and sixth surfaces, and the first and second connection portions 131 a and 132 a may be disposed to be spaced apart from the second surface.

The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110. The external electrodes 131 and 132 may include first and second electrodes 131 and 132, respectively disposed on the third and fourth surfaces 3 and 4 of the body 110 to be connected to the first and second internal electrodes 121 and 122.

The external electrodes 131 and 132 may include a first external electrode 131, including a first connection portion 131 a disposed on the third surface 3 and a first band portion 131 b extending from the first connection portion 131 a onto a portion of the first surface 1, and a second external electrode 132 including a second connection portion 132 a disposed on the fourth surface 4 and a second band portion 132 b extending from the second connection portion 132 a onto a portion of the first surface 1. The first connection portion 131 a may be connected to the first internal electrode 121 on the third surface 3, and the second connection part 132 a may be connected to the second internal electrode 122 on the fourth surface 4.

In addition, the first external electrode 131 may include a third band portion 131 c extending from the first connection portion 131 a onto a portion of the second surface 2, and the second external electrode 132 may include a fourth band portion 132 c extending from the second connection portion 132 a onto a portion of the second surface 2. Furthermore, the first external electrode 131 may include a first side band portion extending from the first connection portion 131 a onto a portion of the fifth and sixth surfaces 5 and 6, and the second external electrode 132 may include a second side band portion extending from 132 a onto a portion of the fifth and sixth surfaces 5 and 6.

However, the third band portion, the fourth band portion, the first side band portion, and the second side band portion may not be essential components of the present disclosure. The first and second external electrodes 131 and 132 may not be disposed on the second surface 2 or may not be disposed on the fifth and sixth surfaces 5 and 6. As the first and second external electrodes 131 and 132 are not disposed on the second surface 2, the first and second external electrodes 131 and 132 may be disposed on a level the same as or lower than a level of an extension line of the second surface of the body. In addition, referring to FIGS. 36 and 37 showing various exemplary embodiments of a multilayer ceramic electronic component 1005′, 1005″ (modified examples of the multilayer ceramic electronic component 1005 in FIG. 14 ), the first and second connection portions 131 a-5′ and 132 a-5′ may be disposed to be spaced apart from the fifth and sixth surfaces 5 and 6, and the first and second connection portions 131 a-5″ and 132 a-5″ may be disposed to be spaced apart from the second surface 2. In addition, the first and second band portions 131 b and 132 b may also be disposed to be spaced apart from the fifth and sixth surfaces 5 and 6.

When the first and second external electrodes 131 and 132 include the third and fourth band portions 131 c and 132 c, the cover layer is illustrated as being disposed on the third and fourth band portions 131 c and 132 c. However, exemplary embodiments are not limited thereto, and plating layers may be disposed on the third and fourth band portions 131 c and 132 c to improve ease of mounting. In addition, the first and second external electrodes 131 and 132 may include the third and fourth band portions 131 c and 132 c, but may not include the side band portion. In this case, the first and second connection portions 131 a and 132 a, and the first to fourth band portions 131 a, 132 b, 131 c, and 132 c may have a shape spaced apart from the fifth and sixth surfaces.

A structure, in which the multilayer electronic component 1000 has two external electrodes 131 and 132, has been described in the present embodiment. However, the number and shape of the external electrodes 131 and 132 may vary depending on the shape of the internal electrodes 121 and 122 or other objects.

The external electrodes 131 and 132 may be formed of any material having electrical conductivity, such as a metal, and a specific material of each of the external electrodes 131 and 132 may be determined in consideration of electrical characteristics, structural stability, and the like. Furthermore, the external electrodes 131 and 132 may have a multilayer structure.

The electrode layers 131 and 132 may be sintered electrodes including a conductive metal and glass or resin-based electrodes including a conductive metal or a resin.

In addition, the electrode layers 131 and 132 may have a form in which sintered electrodes and resin-based electrodes are sequentially formed on the body. In addition, the electrode layers 131 and 132 may be formed by a method of transferring a sheet including a conductive metal to the body or be formed by a method of transferring a sheet including a conductive metal to a sintered electrode.

The conductive metal, included in the electrode layers 131 and 132, is not limited as long as it is any material that may be electrically connected to the internal electrodes in order to form capacitance, and may include at least one selected from the group consisting of, for example, nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), or alloys thereof. In detail, the external electrodes 131 and 132 may include at least one of nickel (Ni) or a Ni alloy, and thus, connectivity to the internal electrodes 121 and 122 including Ni may be further improved.

The insulating layer 151 may be disposed on the second surface to extend to a portion on the first and second connection portions 131 a and 132 a.

Since the first and second connection portions 131 a and 132 a are portions connected to the internal electrodes 121 and 122, they may be a path along which a plating solution permeates in a plating process or moisture permeates during actual use. In the present disclosure, since the cover layer 151 is disposed on the connection portions 131 a and 132 a, the permeation of external moisture or permeation of a plating solution may be prevented.

The insulating layer 151 may be disposed to be in contact with the first and second plating layers 141 and 142. In this case, the insulating layer 151 may partially cover and be in contact with distal ends of the first and second plating layers 141 and 142, or the first and second plating layers 141 and 142 may partially cover and be in contact with distal a distal end of the cover layer 151.

When the external electrodes 131 and 132 are not disposed on the second surface, the insulating layer 151 may be disposed to cover an entire second surface 2. In addition, the insulating layer 151 does not need to be disposed on the second surface 2, and the insulating layer 151 may not be disposed on a portion or an entirety of the second surface 2, and may be divided to be respectively disposed on the first and second connection portions 131 a and 132 a.

In an exemplary embodiment, the insulating layer 151 may be disposed on the first and second connection portions 131 a and 132 a.

Since the first and second connection portions 131 a and 132 a are portions connected to the internal electrodes 121 and 122, they may be a path along which a plating solution permeates in a plating process or moisture permeates during actual use. In the present disclosure, the insulating layer 151 is disposed on the connection portions 131 a and 132 a, so that permeation of external moisture or penetration of a plating solution may be prevented.

The insulating layer 151 may be disposed to be in contact with the first and second plating layers 141 and 142. In this case, the insulating layer 151 may partially cover and be is in contact with distal ends of the first and second plating layers 141 and 142, or the first and second plating layers 141 and 142 may partially cover and be in contact with a distal end of the insulating layer 151.

The insulating layer 151 may be disposed on the first and second connection portions 131 a and 132 a and may be disposed to cover the second surface and the third and fourth band portions 131 c and 132 c. In this case, the insulating layer 151 may be disposed to cover a region, in which the third and fourth band portions 131 c and 132 c are not disposed, of the second surface and the third and fourth band portions 131 c and 132 c. Accordingly, the insulating layer 151 may cover a region, in which the distal ends of the third and fourth band portions 131 c and 132 c and the body 110 are in contact with each other, to block a moisture permeation path, resulting in further improved moisture resistance reliability.

The insulating layer 151 may be disposed on the second surface to extend to the first and second connection portions 131 a and 132 a. Also, when the external electrodes 131 and 132 are not disposed on the second surface, the insulating layer may be disposed to cover the entire second surface. The insulating layer 151 does not need to be disposed on the second surface. The insulating layer 151 may not be disposed on a portion or an entirety of the second surface, and may be divided into two insulating layers, respectively disposed on the first and second connection portions 131 a and 132 a. When the insulating layer is not disposed on the entire second surface, the insulating layer may be disposed on a level the same as or lower than a level of an extension line of the second surface. In addition, the insulating layer may not be disposed on the second surface, but extend to the fifth and sixth surfaces on the first and second connection portions 131 a and 132 a to constitute a single insulating layer.

Furthermore, the insulating layer 151 may be disposed to cover the first and second side band portions and portions of the fifth surface and the sixth surface. In this case, the portions of the fifth and sixth surfaces, which are not covered with the cover layer 151, may be exposed to the outside.

In addition, the insulating layer 151 may be disposed to cover an entirety of the first and second side band portions, the fifth surface, and the sixth surface. In this case, the fifth surface and the sixth surface may not be exposed to the outside, resulting in improved moisture resistance reliability. In addition, the connection portions 131 a and 132 a may not be directly exposed to the outside, resulting in improved reliability of the multilayer electronic component 1000. For example, the insulating layer 151 may cover an entirety of the first and second side band portions, and may cover all regions of the fifth and sixth surfaces except for a region in which the first and second side band portions are formed.

The insulating layer 151 may serve to prevent the plating layers 141 and 142 from being formed on the external electrodes 131 and 132 on which the cover layer 151 is disposed, and may serve to improve sealing characteristics to prevent moisture or a plating solution from externally permeating.

A material of the insulating layer 151 does not need to be limited, and the insulating layer 151 may include an insulating material to have electrically insulating properties. For example, the insulating material included in the insulating layer 151 may be at least one selected from the group consisting of an epoxy resin, an acrylic resin, ethyl cellulose, or the like, or may be glass. For example, a material of the insulating layer 151 may be, in detail, a glass material having improved resistance to a plating solution and in which a mole fraction of silicon (Si) is 20 mol % or more to 65 mol % or less.

When the insulating layer 151 includes glass, there is a high possibility that delamination of the insulating layer 151 b may occur. However, according to an exemplary embodiment, a plating layer may be formed to have a thickness “t1”, greater than a thickness “t2” of an insulating layer to decrease an area in which the plating layer and the insulating layer are in contact with each other, so that occurrence of delamination may be effectively prevented even when the insulating layer 151 b includes glass. Accordingly, when the insulating layer 151 b includes glass, the effect of preventing the delamination of the insulating layer 151 may be more remarkable.

A method of forming the insulating layer 151 does not need to be limited. For example, the insulating layer 151 may be formed by forming the external electrodes 131 and 132 on the body 110, forming the base layer 151, applying a paste containing glass powder particles to a resulting structure or dipping the resulting structure in a paste including glass, and then performing a heat treatment.

The first and second plating layers 141 and 142 may be disposed on the first and second band portions 131 b and 132 b, respectively. The plating layers 141 and 142 may serve to improve the mounting characteristics. As the plating layers 141 and 142 are disposed on the band portions 131 b and 132 b, a mounting space may be significantly reduced and permeation of a plating solution into an internal electrode may be significantly reduced to improve reliability. One distal end of the first and second plating layers 141 and 142 may be in contact with the first surface, and the other distal end thereof may be in contact with the insulating layer 151.

The type of the plating layers 141 and 142 is not limited, and each of the plating layers 141 and 142 may be a plating layer including at least one of Cu, Ni, Sn, Ag, Au, PdNi, Sn, Pd, or alloys thereof, and may be formed as a plurality of layers.

As a more specific example of the plating layers 141 and 142, the plating layers 141 and 142 may be Ni plating layers or Sn plating layers, and may have a form in which Ni plating layers and Sn plating layers are sequentially formed on the first and second band portions 131 b and 132 b.

An average thickness “t1” of the first or second plating layer 141 or 142 may be smaller than an average thickness “t2” of the insulating layer 151.

The insulating layer 151 may serve to prevent the permeation of external moisture or a plating solution, but connectivity to the plating layers 141 and 142 may be reduced to cause delamination of the plating layers 141 and 142. When the plating layer is delaminated, adhesion strength to the substrate 180 may be reduced. The “delamination of the plating layers 141 and 142” may mean that a plating layer is partially removed or is physically separated from the external electrodes 131 and 132. Since connectivity between a plating layer and a cover layer is weak, there is high possibility that a gap at an interface between the cover layer and the plating layer may be increased or foreign objects may permeate through the gap, and there is high possibility that the plating layer may be delaminated due to vulnerability to external impact, or the like.

According to the research of the present inventors, it was confirmed that an area, in which an insulating layer and a plating layer are in contact with each other, is in proportion to possibility that the plating layer is delaminated. According to an exemplary embodiment, a plating layer may be formed to have an average thickness “t1”, greater than an average thickness “t2” of an insulating layer, so that an area in which the plating layer and the insulating layer are in contact with each other may be reduced. Thus, occurrence of delamination may be suppressed to improve adhesion strength to a substrate 180 of the multilayer electronic component 1000.

The average thickness “t1” of the first or second plating layer 141 or 142 may be an average value of thicknesses measured at five points disposed at equal intervals on first and second connection portions 131 a and 132 a or first and second band portions 131 b and 132 b, and the average thickness “t2” of the insulating layer 151 may be an average value of thicknesses measured at five points disposed at equal intervals on the first and second connection portions 131 a and 132 a. Other measurement methods and/or tools appreciated by one of ordinary skill in the art, even if not described in the present disclosure, may also be used.

In an exemplary embodiment, t1/t2 is 0.67 or less, where “t1” is an average thickness of the first or second plating layer 141 or 142, and “t2” is an average thickness of the insulating layer 151.

Table 1 illustrates whether delamination occurred, while changing the average thickness “t1” of the first or second plating layer 141 or 142 and the average thickness “t2” of the insulating layer 151.

To determine whether delamination occurred, 400 samples per test number were prepared and a tape test was performed. When a plating layer was separated, a plating layer was determined to be delaminated, and amounts of delaminated plating layers are listed in Table 1.

TABLE 1 Test No. t1 (μm) t2 (μm) t1/t2 Delamination 1 12 8 1.5 181/400  2 8 8 1 113/400  3 7.2 8 0.9 98/400 4 6.4 8 0.8 93/400 5 5.6 8 0.7 87/400 6 5.36 8 0.67 13/400 7 4.8 8 0.6  3/400 8 4.0 8 0.5  0/400 9 3.2 8 0.4  0/400

Test No. 1 is a case in which an average thickness “t1” of a plating layer is greater than an average thickness “t2” of an insulating layer, and it can be seen that there is the largest number of times delamination occurred.

Referring to Test Nos. 1 to 12, it can be seen that as t1/t2 was decreased, the number of times delamination occurred was decreased.

In Test Nos. 3 to 9 in which an average thickness “t1” of a plating layer was lower than an average thickness “t2” of an insulating layer, there were 100 or less samples in which delamination occurred, and a delamination rate was less than 25%. Therefore, it can be seen that the average thickness “t1” of the plating layer is, in detail, lower than the average thickness “t2” of the insulating layer.

In addition, it can be seen that occurrence of delamination was significantly reduced in Test No. 6 in which t1/t2 was 0.67, as compared with Test No. 5 in which t1/t2 was 0.7. Accordingly, t1/t2 may be, in more detail, 0.67 or less.

For example, in Test Nos. 8 and 9 in which t1/t2 was 0.5 or less, there was no sample in which delamination occurred, among 400 samples. Accordingly, t1/t2 may be, in more detail, 0.5 or less.

A lower limit of t1/t2 does not need to be limited. However, when the plating layer has a significantly low thickness, non-plating may occur and the adhesion strength may be reduced. When the insulating layer has a significantly high thickness, capacitance per unit volume may be decreased. Therefore, t1/t2 may be 0.025 or more.

In an exemplary embodiment, the average thickness “t1” of the first or second plating layer may be 0.5 μm or more to 15 μm or less.

When the average thickness “t1” of the first or second plating layer is less than 0.5 μm, non-plating may occur and adhesion strength may be reduced. When the average thickness “t1” of the first or second plating layer is larger than 15 μm, stress in the plating layer may be increased to peel off a substrate, so that adhesion strength may be reduced.

In an exemplary embodiment, the average thickness “t2” of the insulating layer 151 may be 1 μm or more to 20 μm or less.

When the average thickness “t2” of the insulating layer 151 is less than 1 μm, an effect of preventing permeation of moisture or a plating solution by an insulating layer may be insufficient. When the average thickness “t2” of the insulating layer 151 is larger than 20 μm, capacitance per unit volume may be decreased.

In an exemplary embodiment, the first and second plating layers 141 and 142 may disposed to extend to partially cover the first and second connection portions 131 a and 132 a, respectively. In the present embodiment, H1>H2, where “H1” is an average size to an internal electrode, disposed to be closest to the first surface 1, among the first and second internal electrodes 121 and 122, in the first direction, and “H2” is an average size from the extension line of the first surface 1 to a distal end of each of the first and second plating layers 141 and 142 disposed on the first and second connection portions 131 a and 132 a in the first direction. Accordingly, the permeation of the plating solution into the internal electrode during the plating process may be suppressed to improve reliability.

The average sizes “H1” and “H2” may be values obtained by averaging values measured at five points at equal intervals, in the third direction, in a cross-section of the body 110 taken in the first and second directions (an L-T cross-section). The average size “H1” may be an average of values measured at a point in which internal electrode disposed to be closest to the first surface 1 is connected to an external electrode in each cross-section, and the average size “H2” may be an average of values measured based on a distal end of the plating layer in contact with the external electrode. Extension lines of the first surface, serving as a reference when the average sizes “H1” and “H2” are measured, may be the same.

In an exemplary embodiment, 0.2≤B1/L≤0.4 and 0.2≤B2/L≤0.4, where “L” is an average size of the body 110 in the second direction, “B1” is an average size from an extension line of the third surface to the distal end of the first band portion in the second direction, and “B2” an average size from an extension line of the fourth surface to a distal end of the second band portion in the second direction.

When B1/L and B2/L are each less than 0.2, it may be difficult to secure sufficient adhesion strength. On the other hand, when B2/L is greater than 0.4, leakage current may be generated between the first band portion 131 b and the second band portion 132 b under high-voltage current, and the first band portion 131 b and the second band portion 132 b may be electrically connected to each other by plating spreading, or the like, during a plating process.

The average sizes B1, B2, and L may be values obtained by averaging values measured at five points at equal intervals, in the third direction, in a cross-section of the body 110 taken in the first and second directions (an L-T cross-section).

Referring to FIG. 5 illustrating a mounting substrate 1100 on which the multilayer electronic component 1000 is mounted, the plating layers 141 and 142 of the multilayer electronic component 1000 may be bonded to each other by electrode pads 181 and 182 and solders 171 and 172 disposed on a substrate 180.

When the internal electrodes 121 and 122 are laminated in the first direction, the multilayer electronic component 1000 may be horizontally mounted on the substrate 180 such that the internal electrodes 121 and 122 are parallel to a mounting surface. However, exemplary embodiments are not limited to the case of horizontal mounting. When the internal electrodes 121 and 122 are laminated in the third direction, the multilayer electronic component 1000 may be vertically mounted on the substrate 180 such that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

A size of the multilayer electronic component 1000 does not need to be limited.

However, to achieve miniaturization and high capacitance at the same time, thicknesses of dielectric layers and internal electrodes may be reduced to increase the number of laminated layers. Therefore, an effect of improving reliability and capacitance per unit volume may become more remarkable in the multilayer electronic component 1000 having a size of 1005 (length×width, 1.0 mm×0.5 mm) or less.

Accordingly, when the multilayer electronic component 1000 has a length of 1.1 mm or less and a width of 0.55 mm or less in consideration of a manufacturing error and a size of an external electrode, a reliability improvement effect according to the present disclosure may be more remarkable. The length of the multilayer electronic component 1000 may refer to a maximum size of the multilayer electronic component 1000 in the second direction, and the width of the multilayer electronic component 1000 may refer to a maximum size of the multilayer electronic component 1000 in the third direction.

FIG. 6 is a schematic perspective view of a multilayer electronic component 1001 according to an exemplary embodiment in the present disclosure. FIG. 7 is a cross-sectional view taken along line II-II′ of FIG. 6 .

Referring to FIGS. 6 and 7 , in the multilayer electronic component 1001 according to an exemplary embodiment, first and second plating layers 141-1 and 142-1 may be disposed on a level the same as or lower than a level of an extension line E1 of a first surface. Accordingly, during mounting, a height of a solder may be significantly decreased and amounting space may be significantly reduced.

Also, the insulating layer 151-1 may be disposed to extend to a level the same as or lower than a level of the extension line of the first surface to be in contact with the first and second plating layers 141-1 and 142-1.

FIG. 8 is a schematic perspective view of a multilayer electronic component 1002 according to an exemplary embodiment in the present disclosure. FIG. 9 is a cross-sectional view taken along line III-III′ of FIG. 8 .

Referring to FIGS. 8 and 9 , the multilayer electronic component 1002 according to an exemplary embodiment may further include an additional insulating layer 161 disposed on a first surface 1 and disposed between a first band portion 131 b and a second band portion 132 b. Thus, leakage current, which may be generated between the first band portion 131 b and the second band portion 132 b under high-voltage current, or the like, may be prevented.

The type of the additional insulating layer 161 does not need to be limited. For example, the additional insulating layer 161 may be at least one selected from the group consisting of an epoxy resin, an acrylic resin, ethyl cellulose, or the like. The additional insulating layer 161 may include at least one selected from the group consisting of TiO₂, BaTiO₃, Al₂O₃, SiO₂, BaO, or the like, as an additive in addition to the polymer resin. Accordingly, adhesion to a body or an external electrode may be improved. Materials of the additional insulating layer 161 and the insulating layer 151 do not need to be the same, and may be different from each other.

FIG. 10 is a schematic perspective view of a multilayer electronic component 1003 according to an exemplary embodiment in the present disclosure. FIG. 11 is a cross-sectional view taken along line IV-IV′ of FIG. 10 .

Referring to FIGS. 10 and 11 , the multilayer electronic component 1003 according to an exemplary embodiment may satisfy H1<H2, where “H1” is an average size from a first surface 1 to an internal electrode, disposed to be closest to the first surface 1, among first and second internal electrodes 121 and 122, in a first direction, and “H2” is an average size from an extension line of the first surface 1 to a distal end of plating layers 141-3 and 142-3, disposed on first and second connection portions 141-3 and 142-3, in the first direction. Accordingly, an area in contact with a solder during mounting may be increased to improve adhesion strength.

In more detail, H2<T/2, where “T” is an average size of a body 110 in the first direction. For example, H1<H2<T/2. This is because when the average size “H2” is greater than or equal to T/2, an effect of improving moisture resistance reliability by a cover layer may be reduced.

The average sizes “H1,” “H2,” and “T” may be values obtained by averaging values measured at five points at equal intervals, in the third direction, in a cross-section of the body 110 taken in first and second directions (an L-T cross-section). The average size “H1” may be an average of values measured at a point in which an internal electrode disposed to be closest to the first surface 1 is connected to an external electrode in each cross-section, and the average size “H2” may be an average of values measured with respect to a distal end of a plating layer in contact with an external electrode in each cross-section. In addition, the average size “T” may be a value averaged after measuring a maximum size of the body 110 in the first direction in each cross-section.

FIG. 12 is a schematic perspective view of a multilayer electronic component 1004 according to an exemplary embodiment in the present disclosure. FIG. 13 is a cross-sectional view taken along line V-V′ of FIG. 12 .

Referring to FIGS. 12 and 13 , in the multilayer electronic component 1004 according to an exemplary embodiment, an average length “B1” of a first band portion 131 b-4 is greater than an average length “B3” of a third band portion 131 c-4, and an average length “B2” of a second band portion 132 b-4 may be greater than an average length “B4” of a fourth band portion 132 c-4. Accordingly, an area in contact with a solder during mounting may be increased to improve adhesion strength.

In more detail, B3<B1 and B4<B2, where “B1” is an average size from an extension line of a third surface 3 to a distal end of the first band portion 131 b-4 in a second direction, “B2” is an average size from an extension line of a fourth surface 4 to a distal end of the second band portion 132 b-4 in the second direction, “B3” is an average size from an extension line of a third surface 3 to a distal end of the third band portion 131 c-4 in the second direction, and “B4” is an average size from an extension line of a fourth surface 4 to a distal end of the fourth band portion 132 c-4 in the second direction.

In this case, 0.2≤B1/L≤0.4 and 0.2B2/L≤0.4, where “L” is a size of the body 110 in the second direction.

The average sizes “B1,” “B2,” “B,” “B4,” and “L” may be values obtained by averaging values measured at five points at equal intervals, in a third direction, in a cross-section of the body 110 taken in first and second directions (an L-T cross-section).

The first external electrode 131-4 may include a first side band portion extending from the first connection portion 131 a-4 to a portion of the fifth and sixth surfaces, and the second external electrode 132-4 may include a second side band portion extending from the second connection portion 132 a-4 to a portion of the fifth and sixth surfaces. In this case, sizes of the first and second side band portions in the second direction may be gradually increased in a direction toward the first surface. For example, the first and second side band portions may be disposed to have a tapered shape or a trapezoidal shape.

Furthermore, B3≤G1 and B4≤G2, where “B3” is the average size from the extension line of the third surface to the distal end of the third band portion 131 c-4 in the second direction, “B4” is the average size from the extension line of the fourth surface to the distal end of the fourth band portion 132 c-4, “G1” is an average size of a region, in which the third surface and the second internal electrode 122 are spaced apart from each other, in the second direction, and “G2” is an average size of a region, in which the fourth surface and the first internal electrode 121 are spaced apart from each other, in the second direction. Accordingly, a volume occupied by an external electrode may be significantly reduced to increase capacitance per unit volume of the multilayer electronic component 1104.

The average size “G1” may be a value obtained by averaging sizes spaced apart from the third surface in the second direction and measured with respect to five arbitrary second internal electrodes disposed in a central portion in the first direction, and the average size “G2” may be a value obtained by averaging sizes of the regions, spaced apart from the fourth surface measured with respect to five arbitrary first internal electrodes disposed in the central portion in the first direction, in the second direction, in a cross-section of the body taken from a center thereof in the first and second directions.

Furthermore, the average sizes “G1” and “G2” may be obtained at five points at equal intervals, in the third direction, in a cross-section of the body 110 taken in first and second directions (an L-T cross-section), and an average value of the average sizes “G1” and “G2” may be further generalized.

However, the present disclosure does not intend to be limited to B3≤G1 and B4≤G2, and a case in which B3≥G1 and B4≥G2 may be included as an exemplary embodiment. Therefore, in an exemplary embodiment, B3≥G1 and B4≥G2, where “B3” is the average from the extension line of the third surface to the distal end of the third band portion in the second direction, “B4” is the average size from the extension line of the fourth surface to the distal end of the fourth band portion in the second direction, “G1” is an average size of a region, in which a third surface and the second internal electrode are spaced apart from each other, in the second direction, and “G2” is an average size of a region, in which a fourth surface and the first internal electrode are spaced apart from each other, in the second direction.

In an exemplary embodiment, B1≥G1 and B2≥G2, where “B1” is the average size from the extension line E3 of the third surface to the distal end of the first band portion in the second direction, and “B2” is the average size from the extension line of the fourth surface to the distal end of the second band portion in the second direction. Accordingly, adhesion strength between the multilayer electronic component 1004 and a substrate 180 may be improved.

FIG. 14 is a schematic perspective view of a multilayer electronic component 1005 according to an exemplary embodiment in the present disclosure. FIG. 15 is a cross-sectional view taken along line VI-VI′ of FIG. 14 .

Referring to FIGS. 14 and 15 , first and second external electrodes 131-5 and 132-5 of the multilayer electronic component 1005 according to an exemplary embodiment may not be disposed on a second surface and may be disposed third, fourth, and first surfaces to have an L-shape. For example, the first and second external electrodes 131-5 and 132-5 may be disposed on a level the same or lower than a level of an extension line of the second surface.

The first external electrode 131-5 may include a first connection portion 131 a-5, disposed on the third surface 3, and a first band portion 131 b-5 extending from the first connection portion 131 a-5 onto a portion of the first surface 1. The second externa electrode 132-5 may include a second connection portion 132 a-5, disposed on the fourth surface 4, and a second band portion 132 b-5 extending from the second connection portion 132 a-5 onto a portion of the first surface 1. The external electrodes 131-5 and 132-5 may not be disposed on the second surface 2, so that an insulating layer 151-5 may be disposed to cover an entire second surface 2. Accordingly, a volume occupied by the external electrodes 131-5 and 132-5 may be significantly reduced to further improve capacitance per unit volume of the multilayer electronic component 1005. However, the insulating layer 151-5 does not need to be limited to a form covering an entirety of the second surface 2, and an insulating layer does not cover a portion or an entirety of the second surface 2 and may have a form divided to respectively cover the first and second connection portions 131 a-5 and 132 a-5.

In addition, the insulating layer 151-5 may be disposed to cover portions of the fifth and sixth surfaces to further improve reliability. In this case, portions, which are not covered with the insulating layer 151-5, of the fifth and sixth surfaces may be exposed to the outside.

Furthermore, the insulating layer 151-5 may be disposed to cover the entirety of the fifth and sixth surfaces. In this case, the fifth and sixth surfaces may not be exposed to the outside, resulting further improved moisture resistance reliability.

A first plating layer 141-5 may be disposed on the first band portion 131 b-5, and a second plating layer 142-5 may be disposed on the second band portion 132 b-5. The first and second plating layers 141-5 and 142-5 may be disposed to extend to a portion on the first and second connecting portions 132 a-5 and 132 b-5.

In this case, the external electrodes 131-5 and 132-5 may not be disposed even on the fifth and sixth surfaces 5 and 6. For example, the external electrodes 131-5 and 132-5 may be disposed only on the third, fourth, and first surfaces.

In addition, H1<H2, where “H1” is an average size from a first surface 1 to an internal electrode disposed to be closest to the first surface 1, among the first and second internal electrodes 121 and 122, in a first direction, and “H2” is an average size from an extension line of the first surface 1 to plating layers 141-5 and 142-5, disposed on first and second connection portions 131 a-5 and 132 a-5, in the first direction. Accordingly, an area in contact with a solder during mounting may be increased to improve adhesion strength, and contact areas between external electrodes 131-5 and 132-5 and plating layers 141-5 and 142-5 may be increased to suppress an increase in equivalent series resistance (ESR).

In more detail, H2<T/2, where “T” is an average size of the body 110 in the first direction. For example, H1<H2<T/2. This is because when “H2” is greater than or equal to T/2, an effect of improving moisture resistance reliability by a cover layer may be decreased.

The first and second plating layers 141-5 and 142-5 may be disposed to cover a portion of the insulating layer 151-1 on the third and fourth surfaces. For example, as illustrated in FIG. 34 , the plating layers 141-5 and 142-5 may be disposed to cover distal ends of the insulating layer 151-5 on the third and fourth surfaces. Accordingly, adhesion between the insulating layer 151-5 and the plating layers 141-5 and 142-5 may be increased to improve reliability of the multilayer electronic component 1005.

The insulating layer 151-5 may be disposed to cover portions of the first and second plating layers 141-5 and 142-5 on the third and fourth surfaces. For example, as illustrated in FIG. 35 , the insulating layer 151-5 may be disposed to cover distal ends of the plating layers 141-5 and 142-5 on the third and fourth surfaces. Accordingly, the adhesion between the insulating layer 151-5 and the plating layers 141-5 and 142-5 may be increased to improve the reliability of the multilayer electronic component 1005.

FIG. 16 illustrates a modified example of FIG. 14 . Referring to FIG. 16 , in a modified example 1006 of the multilayer electronic component 1005 according to an exemplary embodiment, the first and second external electrodes 131-6 and 132-6 may have an L-shape in which the first and second external electrodes are not disposed on the second surface.

The first external electrode 131-6 may include a first connection portion 131 a-6, disposed on the third surface 3, and a first band portion 131 b-6 extending from the first connection portion 131 a-6 onto a portion of the first surface. The second external electrode 132 a-6 may include a second connection portion 132 a-6, disposed on the fourth surface 4, and a second band portion 132 b-6 extending from the first connection portion 132 a-6 onto a portion of the first surface 1. Since the external electrodes 131-6 and 132-6 are not disposed on the second surface, the insulating layer 151-5 may cover an entirety of the second surface 2. In this case, the external electrodes 131-6 and 132-6 may not be disposed even on the fifth and sixth surfaces 5 and 6. For example, the external electrodes 131-6 and 132-6 may be disposed on only the third, fourth, and first surfaces.

A first additional electrode layer 134 may be disposed between a first connection portion 131 a-6 and the third surface and a second additional electrode layer 135 may be disposed between a second connection portion 132 a-6 and the fourth surface. The first additional electrode layer 134 may be disposed within a range that are not outside the third surface, and the second additional electrode layer 135 may be disposed within a range that are not outside the fourth surface.

FIG. 16 illustrates a modified example of FIG. 14 . Referring to FIG. 16 , in a modified example 1006 of the multilayer electronic component 1005 according to an exemplary embodiment, a first additional electrode layer 134 may be disposed between a first connection portion 131 a-6 and a third surface and a second additional electrode layer 135 may be disposed between a second connection portion 132 a-6 and a fourth surface. The first additional electrode layer 134 may be disposed within a range that are not outside the third surface, and the second additional electrode layer 135 may be disposed within a range that are not outside the fourth surface. The first and second additional electrode layers 134 and 135 may improve electrical connectivity between internal electrodes 121 and 122 and external electrodes 131-6 and 132-6, and may have improved adhesion to the external electrodes 131-6 and 132-6 to serve to further improve mechanical adhesion between the external electrodes 131-6 and 132-6.

The first and second external electrodes 131-6 and 132-6 may have an L-shape in which the first and second external electrodes are not disposed on the second surface.

The first external electrode 131-6 may include a first connection portion 131 a-6, disposed on the first additional electrode layer 134, and a first band portion 131 b-6 extending from the first connection portion 131 a-6 onto a portion of the first surface 1. The second external electrode 132-6 may include a second connection portion 132 a-6, disposed on the second additional electrode layer 135, and a second band portion 132 b-6 extending from the second connection portion 132 a-6 onto a portion of the first surface 1.

The first and second additional electrode layers 131-6 and 132-6 may be formed of any material having electrical conductivity, such as a metal, and a specific material of each of the first and second additional electrode layers 131-6 and 132-6 may be determined in consideration of electrical characteristics, structural stability, and the like. In addition, each of the first and second additional electrode layers 131-6 and 132-6 may be a sintered electrode including a conductive metal and glass, or a resin-based electrode including a conductive metal and a resin. The first and second additional electrode layers 131-6 and 132-6 may be formed by transferring a sheet including a conductive metal onto the body.

As the conductive metal included in the first and second additional electrode layers 131-6 and 132-6, a material having improved electrical conductivity may be used, but is not limited. For example, the conductive metal may be at least one of Cu, Ni, Pd, Ag, Sn, Cr, or alloys thereof. The first and second additional electrode layers 131-6 and 132-6 may include at least one of, in detail, Ni or a Ni-alloy. Accordingly, connectivity to the internal electrodes 121 and 122 including Ni may be further improved.

FIG. 17 is a schematic perspective view of a multilayer electronic component 2000 according to an exemplary embodiment in the present disclosure. FIG. 18 is a cross-sectional view taken along line VII-VII′ of FIG. 17 .

Referring to FIGS. 17 and 18 , the multilayer electronic component 2000 according to an exemplary embodiment may include a body 110 including dielectric layers 111 and first and second internal electrodes 121 and 122 alternately disposed with respective dielectric layers 111 interposed therebetween, and having first and second surfaces 1 and 2 opposing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and opposing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces 1, 2, 3, and 4 and opposing each other in a third direction; a first external electrode 231 including a first connection electrode 231 a, disposed on the third surface 3, and a first band electrode 231 b disposed on the first surface 1 to be connected to the first connection electrode 231 a; a second external electrode 232 including a second connection electrode 232 a, disposed on the fourth surface 4, and a second band electrode 232 b disposed on the first surface 1 to be connected to the second connection electrode 232 a; a first insulating layer 251 disposed on the first connection electrode 231 a; a second insulating layer 252 disposed on the second connection electrode 232 a; a first plating layer 241 disposed on the first band electrode 231 b; and a second plating layer 242 disposed on the second band electrode 232 b. An average thickness “t1′” of the first or second plating layer 241 or 242 is smaller than an average thickness “t2′” of the first and second insulating layers 251 and 252.

The first connection electrode 231 a may be disposed on the third surface 3 to be connected to the first internal electrode 121, and the second connection electrode 231 b may be disposed on the fourth surface 4 to be connected to the second internal electrode 122. In addition, the first insulating layer 251 may be disposed on the first connection electrode 231 a, and the second insulating layer 252 may be disposed on the second connection electrode 232 a.

In the related art, a method of dipping a surface, on which an internal electrode of a body is exposed, into a paste including a conductive metal has been mainly used when forming an external electrode. However, in the external electrode formed by the dipping method, a thickness of a central portion in a thickness direction may be significantly large. In addition to a thickness imbalance issue of the external electrode according to the dipping method, due to exposure of internal electrodes to third and fourth surface of the body, each of the external electrodes disposed on the third and fourth surfaces may be formed to have a thickness, greater than or equal to a predetermined thickness, to suppress permeation of moisture and a plating solution through the external electrodes.

Meanwhile, in the present disclosure, the insulating layers 251 and 252 are disposed on the connection electrodes 231 a and 232 a, so that sufficient reliability may be secured even when the connection electrodes 231 a and 232 a are formed to be thin on the third and fourth surfaces on which internal electrodes are exposed.

The first and second connection electrodes 231 a and 232 a may have a shape corresponding to the third and fourth surfaces, respectively. A surface directed toward the body 110 from the first and second connection electrodes 231 a and 232 a may have the same area as each of the third and fourth surfaces of the body 110. The first and second connection electrodes 231 a and 232 a may be disposed within a range that is not outside the third and fourth surfaces 3 and 4, respectively. The connection electrodes 231 a and 232 a may be disposed to not extend to the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the body 110. For example, in an exemplary embodiment, the first and second connection electrodes 231 a and 232 a may be disposed to be spaced apart from the fifth and sixth surfaces 5 and 6. Accordingly, a volume occupied by the external electrodes may be significantly reduced to further increase capacitance per unit volume of the multilayer electronic component 2000 while securing sufficient connectivity between the internal electrodes 121 and 122 and the external electrodes 231 and 232.

In this regard, the first and second connection electrodes 231 a and 231 a may be disposed to be spaced apart from the second surface 2. For example, as the external electrodes 231 and 231 are not disposed on the second surface 2, a volume occupied by the external electrodes 231 and 232 may be further significantly decreased to further increase capacitance per unit volume of the multilayer electronic component 2000.

However, the connection electrodes 231 a and 232 a may include a corner portion extending to a corner of the body 110 to be disposed on the corner. For example, in an exemplary embodiment, the first connection electrode may include a corner portion disposed to extend upwardly of a 1-3-th corner and a 2-3-th corner, and the second connection electrode may include a corner portion disposed to extend upwardly of a 1-4-th corner and a 2-4-th corner.

In addition, each of the connection electrodes 231 a and 232 a may have a uniform and low thickness, as compared with an external electrode formed by a dipping method according to the related art.

A method of forming the connection electrodes 231 a and 232 a does not need to be limited. For example, the connection electrodes 231 a and 232 a may be formed by transferring a sheet, including organic materials such as a conductive metal and a binder, to the third and fourth surfaces 3 and 4.

A thickness of each of the connection electrodes 231 a and 232 a is not limited, but may be, for example, 2 to 7 μm. The thickness of each of the connection electrodes 231 a and 232 a may refer to a maximum thickness thereof, and may refer to a size of each of the connection electrodes 231 a and 232 a in a second direction.

In an exemplary embodiment, the first and second connection electrodes 231 a and 232 a may include the same metal and glass as those included in the internal electrodes 121 and 122. As the first and second connection electrodes 231 a and 232 a include the same metal as the metal included in the internal electrodes 121 and 122, electrical connectivity to the internal electrodes 121 and 122 may be improved. In addition, as the first and second connection electrodes 231 a and 232 a include glass, adhesion to the body 110 and/or the insulating layers 251 and 252 may be improved. In this case, the same metal as the metal included in the internal electrodes 121 and 122 may be nickel (Ni).

The first and second insulating layers 251 and 252 may be respectively disposed on the first and second connection electrodes 231 a and 232 a to serve to prevent a plating layer from being formed on the first and second connection electrodes 231 a and 232 a. In addition, the first and second insulating layers 251 and 252 may serve to improve sealing characteristics to significantly reduce permeation of external moisture or an external plating solution.

A material of the insulating layers 251 and 252 does not need to be limited, and the insulating layers 251 and 252 may include an insulating material to have electrically insulating properties. For example, the insulating material included in the insulating layers 251 and 252 may be at least one selected from the group consisting of an epoxy resin, an acrylic resin, ethyl cellulose, and the like, or may be glass. For example, a material of the insulating layers 251 and 252 may be, in detail, a glass material having improved resistance to a plating solution and in which a mole fraction of silicon (Si) is 20 mol % or more to 65 mol % or less.

When the insulating layer 151 includes glass, there is a high possibility that delamination of a plating layer may occur because the glass has lower connectivity to the plating layer than other insulating material. According to an exemplary embodiment, a plating layer may be formed to have a thickness “t1′”, greater than a thickness “t2′” of an insulating layer to decrease an area in which the plating layer and the insulating layer are in contact with each other, so that occurrence of delamination may be effectively prevented even when the insulating layers 251 and 252 include glass. Accordingly, when the insulating layers 251 and 252 includes glass, the effect of preventing the delamination of the plating layers 241 and 242 may be more remarkable.

A method of forming the insulating layers 251 and 252 does not need to be limited. For example, the insulating layers 251 and 252 may be formed by applying a paste containing glass powder particles to a resulting structure or transferring a sheet containing glass powder particles to the connection electrodes 231 a and 232 a.

In an exemplary embodiment, t1′/t2′ may be 0.67 or less, where t1′ is an average thickness of the first or second plating layer, and t2′ is an average thickness of the first and second insulating layers.

The first and second band electrodes 231 b and 232 b may be disposed on the first surface 1 of the body 110. The first and second band electrodes 231 b and 232 b may be in contact with the first and second connection electrodes 231 a and 232 a to be electrically connected to the first and second internal electrodes 121 and 122, respectively.

An external electrode formed by the dipping method according to the related art may have a large thickness on third and fourth surfaces and may partially extend to the first, second, fifth and sixth surfaces, so that it may be difficult to secure a high effective volume ratio.

Meanwhile, according to an exemplary embodiment in the present disclosure, the first and second connection electrodes 231 a and 232 a may be disposed on a surface, on which internal electrodes are exposed, and the first and second band electrodes 231 b and 232 b may be disposed on a surface mounted on a substrate, so that a high effective volume ratio may be secured.

When the internal electrodes 121 and 122 are laminated in a first direction, the multilayer electronic component 2000 may be horizontally mounted on a substrate such that the internal electrodes 121 and 122 are parallel to a mounting surface. However, the present disclosure is not limited to the case in which the multilayer electronic component 2000 is horizontally mounted and, when the internal electrodes 121 and 122 are laminated in the third direction, the multilayer electronic component 2000 may be vertically mounted on the substrate such that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

The first and second band electrodes 231 b and 232 b may be formed of any material such as a metal as long as it has electrical conductivity, and a specific material may be determined in consideration of electrical characteristics and structural stability. For example, the first and second band electrodes 231 and 232 b may be sintered electrodes including conductive metal and glass, and may be formed using a method of applying a paste, including a conductive metal and glass, the first surface of the body. However, exemplary embodiments are not limited thereto, and each of the first and second band electrodes 231 and 232 b may be a plating layer formed by plating a conductive metal on the first surface of the body.

As the conductive metal included in the first and second band electrodes 231 b and 232 b, a material having improved electrical conductivity may be used, and is not limited. For example, the conductive metal may be at least one of nickel (Ni), copper (Cu), or alloys thereof, and may include the same metal as the metal included in the internal electrodes 121 and 122.

The first and second band electrodes 231 b and 232 b may be formed of any material having electrical conductivity, such as a metal, and a specific material of each of the first and second band electrodes 231 b and 232 b may be determined in consideration of electrical characteristics, structural stability, and the like. In addition, each of the first and second band electrodes 231 b and 232 b may be a sintered electrode including a conductive metal and glass, and may be formed by transferring a sheet including a conductive metal onto the first surface of the body.

As the conductive metal included in the first and second band electrodes 231 b and 232 b, a material having improved electrical conductivity may be used, but is not limited. For example, the conductive metal may be at least one of nickel (Ni), copper (Cu), or an alloy thereof.

In an exemplary embodiment, the first external electrode 231 may further include a third band electrode (not illustrated) disposed on the second surface 2 to be connected to the first connection electrode 231 a, and the second external electrode 232 may further include a fourth band electrode (not illustrated) disposed on the second surface 2 to be connected to the second connection electrode 232 a.

In the present embodiment, B1≥G1, B3≤G1, B2≥G2, and B4≤G2, where “B1” is a distance from an extension line E3 of the third surface to a distal end of the first band electrode 231 b, “B2” is a distance from an extension line E4 of the fourth surface to a distal end of the second band electrode 232 b, “B3” is a distance from an extension line of the third surface to a distal end of the third band electrode (not illustrated), “B4” is a distance from an extension line of the fourth surface to a distal end of the fourth band electrode (not illustrated), “G1” is an average size of a region, in which he third surface and the second internal electrode 122 are spaced apart from each other, in a second direction, and “G2” is an average size of a region, in which the fourth surface and the first internal electrode 121 are spaced apart from each other, in the second direction. Accordingly, a volume occupied by the external electrode may be significantly reduced to increase capacitance per unit volume of the multilayer electronic component 2000 and to increase an area in contact with the solder during mounting, resulting in improved adhesion strength.

However, the present disclosure does not intend to be limited to invention to B1≥G1, B3≤G1, B2≥G2, and B4≤G2, and a case in which B1≥G1, B3≤G1, B2≥G2, and B4≥G2 may be included as an exemplary embodiment. Accordingly, in the present embodiment, B1≥G1, B3≤G1, B2≥G2, and B4≥G2, where “B1” is a distance from the extension line E3 of the third surface to the distal end of the first band electrode 231 b, “B2” is the distance from the extension line E4 of the fourth surface to the distal end of the second band electrode 232 b, “B3” is the distance from the extension line of the third surface to the distal end of the third band electrode (not illustrated), “B4” is the distance from the extension line of the fourth surface to the distal end of the fourth band electrode (not illustrated), “G1” is the average size of the region in which the third surface and the second internal electrode 122 are spaced apart from each other, in the second direction, and “G2” is the average size of the region, in which the fourth surface and the first internal electrode 121 are spaced apart from each other, in the second direction. Accordingly, one of the first and second surfaces may be used as the mounting surface, so that ease of mounting may be improved.

The first and second plating layers 241 and 242 may be disposed on the first and second band electrodes 231 b and 232 b. The first and second plating layers 241 and 242 serve to improve mounting characteristics. The types of the first and second plating layers 241 and 242 are not limited, and each of the first and second plating layers 241 and 242 may be a plating layer including at least one of Ni, Sn, Pd, or alloys thereof and may be formed as a plurality of layers.

As a more specific example of the first and second plating layers 241 and 242, each of the first and second plating layers 241 and 242 may be a Ni plating layer or a Sn plating layer. Alternatively, the plating layers 341 and 342 may have a form in which a Ni plating layer and a Sn plating layer may be sequentially formed on the first and second band electrodes 231 b and 232 b.

In an exemplary embodiment, the first and second plating layers 241 and 242 may extend to partially cover the first and second connection electrodes 231 a and 232 a, respectively.

In the present embodiment, H1>H2, where “H1” is an average size from the first surface 1 to the internal electrode disposed to be closest to the first surface 1, among the first and second internal electrodes 121 and 122, in the first direction, and “H2” is an average size from an extension line of the first surface 1 to distal ends of the first and second plating layers 241 and 242, disposed on the first and second connection electrodes 231 a and 232 a, in the first direction. Accordingly, permeation of a plating solution into an internal electrode during a plating process may be suppressed to improve reliability.

In an exemplary embodiment, the first and second insulating layers 251 and 252 are disposed to be in direct contact with the first and second connection electrodes 231 a and 232 a, respectively, and the first and second connection electrodes 231 a and 232 a may include a conductive metal and a resin. Accordingly, the plating layers 241 and 242 may not be disposed in a region in which the insulating layers 251 and 252 are disposed, among the external surfaces of the first and second connection electrodes 231 a and 232 a, so that erosion of external electrodes caused by a plating solution may be effectively suppressed.

In an exemplary embodiment, the first and second insulating layers 251 and 252 may be disposed to be in direct contact with the first and second connection electrodes 231 a and 232 a, respectively, and the first and second connection electrodes 231 a and 232 a may include a conductive metal and a resin. Accordingly, the plating layers 241 and 242 may not be disposed in a region, in which the insulating layers 251 and 252 are disposed, of external surfaces of the first and second connection electrodes 231 a and 232 a, so that erosion of external electrodes caused by a plating solution may be effectively suppressed.

In an exemplary embodiment, the first plating layer 241 may be disposed to cover a distal end disposed on the first external electrode 231 of the first insulating layer 251, and the second plating layer 242 may be disposed to cover a distal end disposed on the second external electrode 232 of the second insulating layer 252. Accordingly, adhesion between the insulating layers 251 and 252 and the plating layers 241 and 242 may be increased to improve reliability of the multilayer electronic component 3000. In addition, by forming the first and second insulating layers 251 and 252 before forming the plating layers 241 and 242 on the external electrodes 231 and 232, the permeation of the plating solution during formation of the plating layer may be more reliably suppressed. As the insulating layer is formed before forming the plating layer, the plating layers 241 and 242 may have a form covering distal ends of the insulating layers 251 and 252.

In an exemplary embodiment, the first insulating layer 251 may be disposed to cover a distal end disposed on the first external electrode 231 of the first plating layer 241, and the second insulating layer 252 may be disposed to cover a distal end dispose on the second external electrode 232 of the second plating layer 242. Accordingly, adhesion between the insulating layer 251 and the plating layers 241 and 242 may be increased to improve reliability of the multilayer electronic component 3000.

FIG. 19 is a view illustrating a modified example of FIG. 17 . Referring to FIG. 17 , in a modified example 2001 of the multilayer electronic component 2000 according to an exemplary embodiment, first and second insulating layers 251-1 and 252-1 may extend to fifth and sixth surfaces 5 and 6 to be connected to each other to constitute a single insulating layer 253-1. In this case, the first and second insulating layers 251-1 and 252-1 connected to each other may be disposed to cover portions of the fifth and sixth surfaces.

FIG. 20 is a schematic perspective view of a multilayer electronic component 2002 according to an exemplary embodiment in the present disclosure. FIG. 21 is a cross-sectional view taken along line VIII-VIII′ of FIG. 20 .

Referring to FIGS. 20 and 21 , in the multilayer electronic component 2002 according to an exemplary embodiment, first and second plating layers 241-2 and 242-2 may be disposed on a level the same as or lower than a level of the extension line of the first surface. Accordingly, a height of a solder may be significantly reduced during mounting, and a mounting space may be significantly reduced.

In addition, the first and second insulating layers 251-2 and 252-2 may extend to a level the same as or lower than the extension line of the first surface to be in contact with the first and second plating layers 241-2 and 242-2.

FIG. 22 is a view illustrating a modified example 2003 of FIG. 20 . Referring to FIG. 22 , in the modified example 2003 of the multilayer electronic component 2002 according to an exemplary embodiment, first and second insulating layers 251-3 and 252-3 may extend to fifth and sixth surfaces 5 and 6 to be connected to each other to constitute a single insulating layer 253-3. In this case, the first and second insulating layers 251-3 and 252-3 connected to each other may be disposed to cover the entire fifth and sixth surfaces.

FIG. 23 is a schematic perspective view of a multilayer electronic component 2004 according to an exemplary embodiment in the present disclosure. FIG. 24 is a cross-sectional view taken along line IX-X′ of FIG. 25 .

Referring to FIGS. 23 and 24 , the multilayer electronic component 2004 according to an exemplary embodiment may further include an additional insulating layer 261 disposed on a first surface 1 and disposed between a first band electrode 231 b and a second band electrode 232 b. Accordingly, leakage current, which may be generated between the first band electrode 231 b and the second band electrode 232 b under a high-voltage current, may be prevented.

The type of the additional insulating layer 261 does not need to be limited. For example, the additional insulating layer 261 may include at least one selected from the group consisting of an epoxy resin, an acrylic resin, ethyl cellulose, and the like. Also the additional insulating layer 261 may include at least one selected from the group consisting of TiO₂, BaTiO₃, Al₂O₃, SiO₂, BaO, and the like, as an additive in addition to the polymer resin. Accordingly, adhesion to a body or an external electrode may be improved. Materials of the additional insulating layer 261 and the insulating layers 251-1 and 252-1 do not need to be the same, and may be different from each other.

FIG. 25 is a view illustrating a modified example 2005 of FIG. 23 . Referring to FIG. 25 , in the modified example 2005 of the multilayer electronic component 2004 according to an exemplary embodiment, first and second insulating layers 251-5 and 252-5 may extend to fifth and sixth surfaces 5 and 6 to be connected to each other to constitute a single insulating layer 253-5.

FIG. 26 is a schematic perspective view of a multilayer electronic component 2006 according to an exemplary embodiment in the present disclosure. FIG. 27 is a cross-sectional view taken along line X-X′ of FIG. 26 .

Referring to FIGS. 26 and 27 , the multilayer electronic component 2006 according to an exemplary embodiment may include a first insulating layer 251-6, disposed on a first connection electrode 231 a, and a second insulating layer 252-6 disposed on a second connection electrode 232 a. In the present embodiment, H1<H2, where H1 is an average size from a first surface 1 to an internal electrode disposed to be closest to the first surface 1, among first and second internal electrodes 121 and 122, in a first direction, and H2 is an average size from an extension line of the first surface 1 to a distal end of first and second plating layers 241-6 and 242-6, disposed on the first and second connection electrodes 231 a and 232 a, in the first direction. Accordingly, an area in contact with a solder during mounting may be increased to improve adhesion strength.

In more detail, H2<T/2, where “T” is an average size of a body 110 in the first direction. For example, H1<H2<T/2. This is because when H2 is greater than or equal to T/2, an effect of improving moisture resistance reliability by an insulating layer may be decreased.

FIG. 28 is a view illustrating a modified example 2007 of FIG. 26 . Referring to FIG. 28 , in the modified example 2007 of the multilayer electronic component 2006 according to an exemplary embodiment, first and second insulating layers 251-7 and 252-7 may extend to fifth and sixth surfaces 5 and 6 to be connected to each other to constitute a single insulating layer 253-7.

FIG. 29 is a schematic perspective view of a multilayer electronic component 2008 according to an exemplary embodiment in the present disclosure. FIG. 30 is a cross-sectional view taken along line XI-XI′ of FIG. 29 .

Referring to FIGS. 29 and 30 , in the multilayer electronic component 2008 according to an exemplary embodiment may extend to second, fifth, and sixth surfaces 2, 5, and 6 to be connected to each other to constitute a single insulating layer 253-8. As illustrated in FIG. 30 , the insulating layer 253-8 may have a form covering an entirety of the second surface and only portions of the fifth and sixth surfaces.

FIG. 31 is a schematic perspective view of a multilayer electronic component 3000 according to an exemplary embodiment in the present disclosure. FIG. 32 is a cross-sectional view taken along line XII-XII′ of FIG. 31 . FIG. 33 is an enlarged view of region K1 of FIG. 31 .

Referring to FIGS. 31 to 33 , the multilayer electronic component 3000 according to an exemplary embodiment may include a body 110 including dielectric layers 111 and first and second internal electrodes 121 and 122 alternately disposed with respective dielectric layers 111 interposed therebetween and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first external electrode 331 including a first connection portion 331 a disposed on the third surface of the body 110, a first band portion 331 b extending from the first connection portion 331 a onto a portion of the first surface 1, and a first corner portion 331 c disposed to extend from the first connection portion 331 a to a corner connecting the second and third surfaces to each other; a second external electrode 332 including a second connection portion 332 a disposed on the fourth surface of the body 110, a second band portion 332 b extending from the second connection portion 332 a onto a portion of the first surface, and a second corner portion 332 c disposed to extend from the second connection portion 332 a to a corner connecting the second and fourth surfaces of the body 110; an insulating layer 351 disposed on the first and second connection portions 331 a and 332 a and disposed to cover the second surface 2 and the first and second corner portions 331 c and 332 c; a first plating layer 341 disposed on the first band portion 331 b; and a second plating layer 342 disposed on the second band portion 332 b. An average thickness of the first or second plating layer 341 or 342 is smaller than an average thickness of the insulating layer 351.

In an exemplary embodiment, B3≤G1 and B4≤G2, where B3 is an average size from an extension line of the third surface to a distal end of the first corner portion in the second direction, B4 is an average size from an extension line of the fourth surface to a distal end of the second corner portion in the second direction, G1 is an average size of a region, in which the third surface and the second internal electrode are spaced apart from each other, in the second direction, and G2 is an average size of a region, in which the fourth surface and the first internal electrode are spaced apart from each other, in the second direction. Accordingly, a volume occupied by the external electrodes 331 and 332 may be significantly reduced to increase capacitance per unit volume of the multilayer electronic component 3000.

In this case, B1≥G1 and B3≥G2, where B1 is the average size from the extension line of the third surface to the distal end of the first band portion 331 b in the second direction, and B2 is the average size from the extension line of the fourth surface to the distal end of the second band portion 332 b in the second direction. Accordingly, an area in contact with the solder during mounting may be increased to improve adhesion strength.

The multilayer electronic component 3000 according to an exemplary embodiment may include a body 110 including dielectric layers 111 and first and second internal electrodes 121 and 122 alternately disposed with respective dielectric layers interposed therebetween and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposed each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction. The body 110 of the multilayer electronic component 3000 may have the same configuration as the body 110 of the multilayer electronic component 1000, except that an end portion of the first or second surface of the body has a contracted shape, as will be described later.

The external electrodes 331 and 332 may be disposed on the third surface 3 and the fourth surface 4 of the body 110. The external electrodes 331 and 332 may include first and second external electrodes 331 and 332, respectively disposed on the third and fourth surfaces 3 and 4 of the body 110 to be connected to the first and second internal electrodes 121 and 122.

The external electrodes 331 and 332 may include a first external electrode 331, including a first connection portion 331 a disposed on the third surface, a first band portion 331 b extending from the first connection portion 331 a to a portion of the first surface, and a first corner portion 331 c disposed to extend from the first connection portion 331 a to a corner connecting the second and third surfaces to each other, and a second external electrode 332 including a second connection portion 332 a disposed on the fourth surface, a second band portion 332 b extending from the second connection portion 332 a to a portion of the first surface, and a second corner portion 332 c disposed to extend from the second connection portion 332 a to a corner connecting the second and fourth surfaces to each other. The first connection portion 331 a may be connected to the first internal electrode 121 on the third surface, and the second connection portion 332 a may be connected to the second internal electrode 122 on the fourth surface.

In an exemplary embodiment, the first and second connection portions 331 a and 332 a may be disposed to be spaced apart from the fifth and sixth surfaces. Accordingly, a proportion of the external electrodes 331 and 332 may be significantly reduced to further miniaturize the multilayer electronic component 3000.

As a margin region, in which the internal electrodes 121 and 122 are not disposed, overlaps the dielectric layer 111, a step may be formed due to a thickness of each of the internal electrodes 121 and 122. Therefore, a corner connecting the first surface to the third to fifth surfaces and/or a corner connecting the second surface to the third to fifth surfaces may have a form contracted toward a center of the body 110 in the first direction, when viewed with respect to the first surface or the second surface. Alternatively, a corner connecting the first surface 1 to the third to sixth surfaces 3, 4, 5, and 6 and/or a corner connecting the second surface 2 to the third to sixth surfaces 3, 4, 5, and 6 may have a form contracted toward the center of the body 110 in the first direction by a shrinkage behavior in a process of sintering the body 110, when viewed with respect to the first surface 1 or the second surface 2. Alternatively, as a corner connecting the respective surfaces of the body 110 is rounded by an additional process to prevent a chipping defect, or the like, a corner connecting the first surface 1 to the third to sixth surfaces 3, 4, 5, and 6 and/or a corner connecting the second surface 2 to the third to sixth surfaces 3, 4, 5, and 6 may have a rounded form.

The corner may include a 1-3-th corner c1-3 connecting the first surface 1 and the third surface 3 to each other, a 1-4-th corner c1-4 connecting the first surface 1 and the fourth surface 4 to each other, a 2-3-th corner c2-3 connecting the second surface 2 and the third surface 3 to each other, and a 2-4-th corner c2-4 connecting the second surface 2 and the fourth surface 4 to each other. Also, the corner may include a 1-5 corner connecting the first surface 1 and the fifth surface 5 to each other, a 1-6-th corner connecting the first surface 1 and the sixth surface 6 to each other, a 2-5-th corner connecting the second surface 2 and the fifth surface 5 to each other, and a 2-6-th corner connecting the second surface 2 and the sixth surface 6 to each other. However, to suppress a step formed by the internal electrodes 121 and 122, after lamination, the internal electrodes may be cut to be exposed to the fifth and sixth surfaces 5 and 6 of the body 110, and then a single dielectric layer or two or more dielectric layers are laminated on opposite side surfaces of a capacitance formation portion Ac in a third direction (a width direction) to form margin portions 114 and 115. In this case, a portion connecting the first surface 1 to the fifth and sixth surfaces 5 and 6 and a portion connecting the second surface 2 to the fifth and sixth surfaces 5 and 6 may not have a contracted form.

The first to sixth surfaces of the body 110 may be overall planar surfaces, and a non-planar regions may be considered to be corners. A region, disposed on a corner, of the external electrodes 131 and 132 may be considered to be a corner portion.

In this regard, the first and second corner portions 331 c and 332 c may be disposed on a level the same as or lower than a level of an extension line E2 of the second surface 2, and the first and second corner portions 331 c and 332 c may be disposed to be spaced apart from the second surface 2. For example, the external electrodes 331 and 332 are not disposed on the second surface 2, so that a volume occupied by the external electrodes 331 and 332 may be further significantly reduced to further increase capacitance per unit volume of the multilayer electronic component 3000. In addition, the first corner portion 331 c may be disposed on a portion of the 2-3-th corner C2-3 connecting the third surface 3 and the second surface 2 to each other, and the second corner portion 332 c may be disposed on a portion of the 2-4-th corner C2-4 connecting the fourth surface 4 and the second surface 2 to each other.

The extension line E2 of the second surface may be defined as follows.

In a cross-section of the multilayer electronic component 3000 taken in length-thickness directions from a center thereof in a width direction (L-T cross-section), seven straight lines P0, P1, P2, P3, P4, P5, P6, and P7 having a uniform thickness from the third surface 3 to the fourth surface 4 in a length direction may be drawn, and a straight line passing through a point, at which the straight line P2 and the second surface 2 meet, and a point, at which the straight line P4 and the second surface 2 meet, may be defined as the extension line E2 of the second surface 2.

The external electrodes 331 and 332 may be formed of any material having electrical conductivity, such as a metal, and a specific material of each of the external electrodes 131 and 132 may be determined in consideration of electrical characteristics, structural stability, and the like. Furthermore, the external electrodes 331 and 332 may have a multilayer structure.

The external electrodes 331 and 332 may be sintered electrodes including a conductive metal and glass, or may be resin-based electrodes including a conductive metal and resin.

In addition, the electrode layers 331 and 332 may have a form in which sintered electrodes and resin-based electrodes are sequentially formed on the body. In addition, the electrode layers 331 and 332 may be formed by a method of transferring a sheet including a conductive metal to the body or be formed by a method of transferring a sheet including a conductive metal to a sintered electrode.

As the conductive metal included in the external electrodes 331 and 332, a material having improved electrical conductivity may be used and is not limited. For example, the conductive metal may be at least one of copper (Cu), nickel (Ni), palladium (Pd), silver (Ag), tin (Sn), chromium (Cr), or alloys thereof. The external electrodes 331 and 332 may include at least one of, in detail, Ni or a Ni alloy. Accordingly, connectivity to the internal electrodes 121 and 122 including Ni may be further improved.

The insulating layer 351 may be disposed on the first and second connection portions 331 a and 332 a.

The first and second connection portions 331 a and 332 a are portions connected to the internal electrodes 121 and 122, and thus, may be paths along which a plating solution permeates during a plating process or moisture permeates during actual use. In the present disclosure, since the insulating layer 351 is disposed on the connection portions 331 a and 332 a, permeation of external moisture or permeation of an external plating solution may be prevented.

The insulating layer 351 may be disposed to be in contact with the first and second plating layers 341 and 342. In this case, the insulating layer 351 may have a form contacting and covering a portion of distal ends of the first and second plating layers 341 and 342, or the first and second plating layers 341 and 342 may have a form contacting and covering a portion of a distal end of the insulating layer 351.

The insulating layer 353 may be disposed on the first and second connection portions 331 a and 332 a and may be disposed to cover the second surface and the first and second corner portions 331 c and 332 c. In addition, the insulating layer 351 may cover a region, in which the distal ends of the first and second corner portions 331 c and 332 c are in contact with the body 110, to block a moisture permeation path, resulting in further improved moisture resistance reliability.

The insulating layer 351 may be disposed on the second surface to extend to the first and second connection portions 331 a and 332 a. Also, the insulating layer 351 may be disposed to cover the entire second surface when the external electrodes 331 and 332 are not disposed on the second surface. The insulating layer 351 does not need to be disposed on the second surface 2, and may not be disposed on a portion or an entirety of the second surface 2 or may be divided into two insulating layers, respectively disposed on the first and second connection portions 331 a and 332 a. However, even in this case, the insulating layer 351 may be disposed to cover an entirety of the first and second corner portions 331 c 332 c. When the insulating layer 351 is not disposed on the entire second surface, the insulating layer 351 may be disposed on a level the same as or lower than a level of an extension line of the second surface. In addition, although the insulating layer 351 is not disposed on the second surface 2, the insulating layer 351 may extend to the fifth and sixth surfaces 5 and 6 on the first and second connection portions 331 a and 332 a to constitute a single insulating layer.

In an exemplary embodiment, the insulating layer 351 may be disposed to cover a portion of the fifth and sixth surfaces 5 and 6 to improve reliability. In this case, portions, which are not covered with the insulating layer 351, of the fifth and sixth surfaces 5 and 6 may be exposed to the outside.

Furthermore, the insulating layer 351 may be disposed to cover the entirety of the fifth and sixth surfaces 5 and 6. In this case, the fifth and sixth surfaces 5 and 6 may not be exposed to the outside, resulting in further improved moisture resistance reliability.

The insulating layer 351 may serve to prevent the plating layers 341 and 342 from being formed on the external electrodes 331 and 332 on which the insulating layer 351 is disposed, and may serve to improve sealing characteristics to significantly reduce permeation of external moisture or permeation of an external plating solution. Components, a composition, an average thickness, and effects of the insulating layer 351 are the same as those of the insulating layers 151, 251, 252, and 253 included in the multilayer electronic components 1000 and 2000 and various embodiments of the multilayer electronic components 1000 and 2000, and descriptions thereof will be omitted.

The first and second plating layers 341 and 342 may be disposed on the first and second band portions 331 b and 332 b, respectively. The plating layers 341 and 342 may serve to improve mounting characteristics. As the plating layers 341 and 342 are respectively disposed on the band portions 331 b and 332 b, a mounting space may be significantly reduced, and permeation of a plating solution into an internal electrode may be significantly reduced to improve reliability. One end of each of the first and second plating layers 341 and 342 may be in contact with the first surface 1, and the other end thereof may be in contact with the insulating layer 351.

The type of the plating layers 341 and 342 is not limited, and each of the plating layers 341 and 342 may be a plating layer including at least one of Cu, Ni, Sn, Ag, Au, Pd, or alloys thereof and may be formed as a plurality of layers.

As a more specific example of the plating layers 341 and 342, the plating layers 341 and 342 may be a Ni plating layer or a Sn plating layer. Alternatively, the plating layers 341 and 342 may have a form in which a Ni plating layer and a Sn plating layer may be sequentially formed on the first and second band electrodes 331 b and 332 b.

In an exemplary embodiment, the insulating layer 351 may be disposed to be in direct contact with the first and second external electrodes 331 and 332, and the first and second external electrodes 331 and 332 may include a conductive metal and glass. Accordingly, the plating layers 341 and 342 may not be disposed in a region, in which the insulating layer 351 is disposed, of the external surfaces of the first and second external electrodes 331 and 332, so that erosion of external electrodes caused by a plating solution may be effectively suppressed.

In an exemplary embodiment, the first plating layer 341 may be disposed to cover a distal end disposed on the first external electrode 331 of the first insulating layer 351, and the second plating layer 342 may be disposed to cover a distal end disposed on the second external electrode 332 of the second insulating layer 352. Accordingly, adhesion between the insulating layers 351 and the plating layers 341 and 342 may be increased to improve reliability of the multilayer electronic component 3000. In addition, by forming the insulating layers 351 before forming the plating layers 341 and 342 on the external electrodes 331 and 332, the permeation of the plating solution during formation of the plating layer may be more reliably suppressed. As the insulating layer is formed before forming the plating layer, the plating layers 341 and 342 may have a form covering a distal end of the insulating layer 351.

In an exemplary embodiment, the insulating layer 351 may be disposed to cover a distal end disposed on the first external electrode 331 of the first plating layer 341, and may be disposed to cover a distal end disposed on the second external electrode 332 of the second plating layer 342. Accordingly, adhesion between the insulating layer 351 and the plating layers 341 and 342 may be increased to improve the reliability of the multilayer electronic component 3000.

In an exemplary embodiment, the first and second plating layers 341 and 342 may disposed to extend to partially cover the first and second connection portions 131 a and 132 a, respectively. In the present embodiment, H1>H2, where “H1” is an average size to an internal electrode, disposed to be closest to the first surface 1, among the first and second internal electrodes 121 and 122, in the first direction, and “H2” is an average size from the extension line of the first surface 1 to a distal end of each of the first and second plating layers 141 and 142 disposed on the first and second connection portions 131 a and 132 a in the first direction. Accordingly, the permeation of the plating solution into the internal electrode during the plating process may be suppressed to improve reliability.

In an exemplary embodiment, H1<H2, where “H1” is an average size from the first surface 1 to an internal electrode disposed to be closest to the first surface 1, among the first and second internal electrodes 121 and 122, in a first direction, and “H2” is an average size from an extension line of the first surface 1 to the plating layer 341 and 342 disposed on the first and second connection portions 331 a and 332 a, in the first direction. Accordingly, an area in contact with a solder during mounting may be increased to improve adhesion strength. In more detail, H2<T/2, where “T” is an average size of the body 110 in the first direction. For example, H1<H2<T/2. This is because when “H2” is greater than or equal to T/2, an effect of improving moisture resistance reliability by an insulating layer may be decreased.

In an exemplary embodiment, the first and second plating layers 341 and 342 may be disposed on a level the same as or lower than a level of an extension line of the first surface. Accordingly, a height of the solder may be significantly reduced during mounting, and a mounting space may be significantly reduced. Also, the insulating layer 351 may extend to a level the same as or lower than the level of the extension line of the first surface to be in contact with the first and second plating layers 341 and 342.

In an exemplary embodiment, 0.2≤B1/L≤0.4 and 0.2≤B2/L≤0.4, where “L” is the average size of the body in the second direction, “B1” is the average size from the extension line of the third surface to the distal end of the first band in the second direction, and “B2” is the average size from the extension line of the fourth surface to the distal end of the second band portion in the second direction.

When B1/L and B2/L are less than 0.2, it may be difficult to secure sufficient adhesion strength. On the other hand, when B2/L is greater than 0.4, leakage current may be generated between the first band portion 331 b and the second band portion 332 b under a high-voltage current and the first band portion 331 b and the second band portion 332 b may be electrically connected to each other by plating spreading, or the like, during a plating process.

In an exemplary embodiment, the multilayer electronic component 3000 may include an additional insulating layer disposed on the first surface and disposed between the first band portion 331 b and the second band portion 332 b. Accordingly, the leakage current which may be generated between the first band electrode 331 b and the second band electrode 332 b under a high-voltage current may be prevented.

The type of the additional insulating layer does not need to be limited. For example, the additional insulating layer may be at least one selected from the group consisting of an epoxy resin, an acrylic resin, ethyl cellulose, and the like, or may include glass.

In an exemplary embodiment, B3<B1 and B4<B2, where “B1” is the average size from the extension line of the third surface to the distal end of the first band in the second direction, and “B2” is the average size from the extension line of the fourth surface to the distal end of the second band portion in the second direction. The average length “B1” of the first band portion 331 b may be larger than the average length “B3” of the first corner portion 331 c, and the average length “B2” of the second band portion 332 b may be larger than the average length “B4” of the second corner portion 332. Accordingly, an area in contact with a solder during mounting may be increased to improve the adhesion strength.

In more detail, B3<B1 and B4<B2, where “B1” is the average size from the extension line of the third surface to the distal end of the first band in the second direction, “B2” is the average size from the extension line of the fourth surface to the distal end of the second band portion in the second direction, “B3” is the average from the extension line of the third surface to the distal end of the third band portion in the second direction, and “B4” is the average size from the extension line of the fourth surface to the distal end of the fourth band portion in the second direction.

In an exemplary embodiment, t1/t2 may be 0.67 or less, where t1 is an average thickness of the first or second plating layer 341 or 342, and t2 is an average thickness of the insulating layer 351.

The insulating layer 351 may serve to prevent permeation of external moisture or a plating solution, but may have weak connectivity to the plating layers 341 and 342 to cause delamination of the plating layers 341 and 342. When the plating layer is delaminated, adhesion strength to a substrate 180 may be reduced. The “delamination of a plating layer” may mean that a plating layer is partially removed or is physically separated from the external electrodes 131-5 and 132-5. Since connectivity between a plating layer and a insulating layer is weak, there is high possibility that a gap at an interface between the insulating layer and the plating layer may be increased or foreign objects may permeate through the gap, and there is high possibility that the plating layer may be delaminated due to vulnerability to external impact, or the like.

According to an exemplary embodiment, the plating layer may be formed to have the average thickness greater than the average thickness of the insulating layer, so that a contact area between the plating layer and the insulating layer may be reduced. Thus, occurrence of delamination may be suppressed to improve adhesion strength to the multilayer electronic component 3000.

A size of the multilayer electronic component 3000 does not need to be limited.

However, to achieve miniaturization and high capacity at the same time, thicknesses of dielectric layers and internal electrodes may be reduced to increase the number of laminated layers. Therefore, an effect of improving reliability and capacitance per unit volume may become more remarkable in the multilayer electronic component 300 having a size of 1005 (length×width, 1.0 mm×0.5 mm).

Accordingly, when the multilayer electronic component 3000 has a length of 1.1 mm or less and a width of 0.55 mm or less in consideration of a manufacturing error and a size of an external electrode, a reliability improvement effect according to the present disclosure may be more remarkable. The length of the multilayer electronic component 3000 may refer to a maximum size of the multilayer electronic component 1000 in the second direction, and the width of the multilayer electronic component 3000 may refer to a maximum size of the multilayer electronic component 1000 in the third direction.

As described above, according to exemplary embodiments, an insulating layer may be disposed on a connection portion of an external electrode, and a plating layer may be disposed on a band portion of the external electrode. Thus, reliability of a multilayer electronic component may be improved while improving capacitance per unit volume of the multilayer electronic component.

In addition, a mounting space of a multilayer electronic component may be significantly reduced.

In addition, a plating layer may be formed to have a thickness, smaller than a thickness of an insulating layer. Thus, delamination may be prevented to improve adhesion strength.

While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present invention as defined by the appended claims. 

What is claimed is:
 1. A multilayer electronic component comprising: a body including dielectric layers and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion onto a portion of the first surface, and a third band portion extending from the first connection portion onto a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, a second band portion extending from the second connection portion onto a portion of the first surface, and a fourth band portion extending from the second connection portion onto a portion of the second surface; an insulating layer disposed on the second surface and disposed to extend onto a portion on the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer, wherein an average thickness of the first or second plating layer is smaller than an average thickness of the insulating layer.
 2. The multilayer electronic component of claim 1, wherein an average thickness of the first and second plating layers is smaller than the average thickness of the insulating layer.
 3. The multilayer electronic component of claim 1, wherein t1/t2 is 0.67 or less, where t1 is an average thickness of the first or second plating layer, and t2 is the average thickness of the insulating layer.
 4. The multilayer electronic component of claim 3, wherein t1/t2 is 0.5 or less.
 5. The multilayer electronic component of claim 3, wherein t1′/t2 is 0.67 or less, where t1′ is an average thickness of the first and second plating layers.
 6. The multilayer electronic component of claim 1, wherein the first and second plating layers each have an average thickness of 0.5 μm or more to 15 μm or less.
 7. The multilayer electronic component of claim 1, wherein the insulating layer has an average thickness of 1 μm or more to 20 μm or less.
 8. The multilayer electronic component of claim 1, wherein the insulating layer includes glass.
 9. The multilayer electronic component of claim 1, wherein H1>H2, where H1 is an average size from the first surface to an internal electrode, disposed to be closest to the first surface, among the first and second internal electrodes, in the first direction, and H2 is an average size from an extension line of the first surface to a distal end of the first or second plating layer disposed on the first and second connection portions in the first direction.
 10. The multilayer electronic component of claim 1, wherein H1<H2, where H1 is an average size from the first surface to an internal electrode, disposed to be closest to the first surface, among the first and second internal electrodes, in the first direction, and H2 is an average size from an extension line of the first surface to a distal end of the first or second plating layer disposed on the first and second connection portions in the first direction.
 11. The multilayer electronic component of claim 10, wherein H2<T/2, where T is an average size of the body in the first direction.
 12. The multilayer electronic component of claim 1, wherein 0.2≤B1/L≤0.4 and 0.2B2/L≤0.4, where L is an average size of the body in the second direction, B1 is an average size from an extension line of the third surface to a distal end of the first band portion in the second direction, and B2 is an average size from an extension line of the fourth surface to a distal end of the second band portion in the second direction.
 13. The multilayer electronic component of claim 1, further comprising: an additional insulating layer disposed on the first surface and disposed between the first band portion and the second band portion.
 14. The multilayer electronic component of claim 1, wherein each of the first and second external electrodes includes at least one of nickel (Ni) or a Ni-alloy.
 15. The multilayer electronic component of claim 1, wherein B3<B1 and B4<B2, where B1 is an average size from an extension line of the third surface to a distal end of the first band portion in the second direction, and B2 is an average size from an extension line of the fourth surface to a distal end of the second band portion in the second direction.
 16. The multilayer electronic component of claim 1, wherein the first and second connection portions are disposed to be spaced apart from the fifth and sixth surfaces.
 17. The multilayer electronic component of claim 1, wherein a maximum size of the multilayer electronic component in the second direction is 1.1 mm or less, and a maximum size of the multilayer electronic component in the third direction is 0.55 mm or less.
 18. The multilayer electronic component of claim 1, wherein the dielectric layer has an average thickness of 0.35 μm or less.
 19. The multilayer electronic component of claim 1, wherein the first and second internal electrodes have an average thickness of 0.35 μm or less.
 20. The multilayer electronic component of claim 1, wherein the body includes a capacitance formation portion, including first and second internal electrodes, alternately disposed with the dielectric layer interposed therebetween, and cover portions, respectively disposed on opposite end surfaces of the capacitance formation portion in the first direction, and an average size of the cover portion in the first direction is 15 μm or less.
 21. The multilayer electronic component of claim 1, wherein the first and second plating layers are disposed on a level the same as or lower than an extension line of the first surface.
 22. The multilayer electronic component of claim 1, wherein the first and second plating layers are disposed to cover a portion of a distal end of the insulating layer.
 23. The multilayer electronic component of claim 1, wherein the insulating layer is disposed to cover a portion of a distal end of each of the first and second plating layers.
 24. A multilayer electronic component comprising: a body including dielectric layers and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second externa electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed to cover an entirety of the second surface and disposed to extend to portions of the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer, wherein t1/t2 is 0.67 or less, where t1 is an average thickness of the first or second plating layer, and t2 is an average thickness of the insulating layer.
 25. The multilayer electronic component of claim 24, wherein t1′/t2 is 0.67 or less, where t1′ is an average thickness of the first and second plating layers.
 26. The multilayer electronic component of claim 24, wherein t1/t2 is 0.5 or less.
 27. The multilayer electronic component of claim 24, wherein the average thickness t1 of the first or second plating layer is 0.5 μm or more to 15 μm or less.
 28. The multilayer electronic component of claim 24, wherein the average thickness t2 of the insulating layer is 1 μm or more to 20 μm or less.
 29. The multilayer electronic component of claim 24, wherein the insulating layer includes glass.
 30. The multilayer electronic component of claim 24, wherein H1>H2, where H1 is an average size from the first surface to an internal electrode, disposed to be closest to the first surface, among the first and second internal electrodes, in the first direction, and H2 is an average size from an extension line of the first surface to a distal end of the first or second plating layer disposed on the first and second connection portions in the first direction.
 31. The multilayer electronic component of claim 24, wherein H1<H2, where H1 is an average size from the first surface to an internal electrode, disposed to be closest to the first surface, among the first and second internal electrodes, in the first direction, and H2 is an average size from an extension line of the first surface to a distal end of the first or second plating layer disposed on the first and second connection portions in the first direction.
 32. The multilayer electronic component of claim 31, wherein H2<T/2, where T is an average size of the body in the first direction.
 33. The multilayer electronic component of claim 24, wherein 0.2≤B1/L≤0.4 and 0.2≤B2/L≤0.4, where L is an average size of the body in the second direction, B1 is an average size from an extension line of the third surface to a distal end of the first band portion in the second direction, and B2 is an average size from an extension line of the fourth surface to a distal end of the second band portion in the second direction.
 34. The multilayer electronic component of claim 24, further comprising: an additional insulating layer disposed on the first surface and disposed between the first band portion and the second band portion.
 35. The multilayer electronic component of claim 24, wherein each of the first and second external electrodes includes at least one of nickel (Ni) or a Ni-alloy.
 36. The multilayer electronic component of claim 24, wherein the first and second connection portions are disposed to be spaced apart from the fifth and sixth surfaces.
 37. The multilayer electronic component of claim 24, wherein the first and second connection portions are disposed to be spaced apart from the second surface.
 38. The multilayer electronic component of claim 24, wherein a maximum size of the multilayer electronic component in the second direction is 1.1 mm or less, and a maximum size of the multilayer electronic component in the third direction is 0.55 mm or less.
 39. The multilayer electronic component of claim 24, wherein the dielectric layer has an average thickness of 0.35 μm or less.
 40. The multilayer electronic component of claim 24, wherein the first and second internal electrodes have an average thickness of 0.35 μm or less.
 41. The multilayer electronic component of claim 24, wherein the body includes a capacitance formation portion, including first and second internal electrodes, alternately disposed with the dielectric layer interposed therebetween, and cover portions, respectively disposed on opposite end surfaces of the capacitance formation portion in the first direction, and an average size of the cover portion in the first direction is 15 μm or less.
 42. The multilayer electronic component of claim 24, wherein the first and second plating layers are disposed on a level the same as or lower than a level of an extension line of the first surface.
 43. The multilayer electronic component of claim 24, wherein the first and second plating layers are disposed to cover a portion of a distal end of the insulating layer.
 44. The multilayer electronic component of claim 32, wherein the insulating layer is disposed to cover a portion of a distal end of each of the first and second plating layers. 